IS42S16320D-6TL
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 649 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320D-6TL – 512 Mbit SDRAM, 54‑TSOP II
The IS42S16320D-6TL is a 512 Mbit synchronous DRAM (SDRAM) organized as 32M × 16 with a parallel memory interface. It implements a pipelined, fully synchronous architecture with internal banking to optimize row access and precharge hiding for high-speed data transfer.
Designed for commercial temperature systems, the device supports programmable burst operations, selectable CAS latency, and standard LVTTL signaling, providing a compact 54-pin TSOP-II package option for space-constrained board designs.
Key Features
- Memory Organization – 512 Mbit SDRAM organized as 32M × 16 with four internal banks to improve access efficiency.
- Performance – Supports a clock frequency up to 166 MHz and an access time from clock of 5.4 ns (typical for -6 speed grade).
- Programmable Timing & Burst – Programmable CAS latency (2 or 3 clocks) and programmable burst lengths (1, 2, 4, 8, full page) with sequential and interleave burst sequencing.
- Synchronous Pipeline Architecture – Fully synchronous operation with all signals referenced to the positive clock edge and internal bank management for row access/precharge hiding.
- Refresh and Low-Power Modes – Auto Refresh and Self Refresh support with standard 8K refresh cycles per 64 ms (commercial mode).
- Interface & Signaling – Parallel memory interface with LVTTL signaling for command and control.
- Power – Supply voltage range 3.0 V to 3.6 V.
- Package – 54-pin TSOP-II (0.400", 10.16 mm width) surface-mount package for compact board layouts.
- Operating Temperature – Commercial temperature range 0°C to +70°C (TA).
Unique Advantages
- High-speed pipelined data transfer: Pipelined, fully synchronous architecture and internal bank structure enable efficient high-frequency operation at the -6 timing grade.
- Flexible burst and latency options: Programmable burst lengths and CAS latency choices let designers balance throughput and timing for target applications.
- Compact package footprint: 54-pin TSOP-II (10.16 mm width) provides a space-efficient footprint for dense PCB integration.
- Standard refresh and self-refresh support: Built-in Auto Refresh and Self Refresh modes simplify memory maintenance and data retention strategies.
- Wide supply margin within specified range: Operates over a 3.0 V to 3.6 V supply window to accommodate common 3.3 V system rails.
- Documented timing and operation: Datasheet details such as access times, clock rates, and command behaviors enable precise system timing design.
Why Choose IS42S16320D-6TL?
The IS42S16320D-6TL delivers a documented, compact 512 Mbit SDRAM solution for systems requiring a parallel synchronous memory with programmable timing and burst flexibility. Its pipelined architecture and internal bank management are tailored for applications that need predictable, high-speed transfers within a commercial temperature range.
This device is well suited to engineers specifying a 32M × 16 SDRAM in a 54-pin TSOP-II package who require clear timing parameters, refresh behavior, and supply range for reliable integration into their designs. Technical details in the product documentation support accurate timing and layout decisions during development.
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