IS42S16320D-6BL-TR
| Part Description |
IC DRAM 512MBIT PAR 54TFBGA |
|---|---|
| Quantity | 643 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TW-BGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320D-6BL-TR – 512Mbit SDRAM, 32M × 16, 54-TFBGA
The IS42S16320D-6BL-TR is a 512 Mbit synchronous DRAM organized as 32M × 16, implemented in a 54-ball thin fine-pitch BGA package. It uses a pipelined, fully synchronous architecture with all signals referenced to the rising clock edge to provide deterministic, high-speed parallel memory access for systems requiring volatile SDRAM storage.
Designed for applications that need 512 Mbit of parallel SDRAM, the device offers programmable burst control, refresh modes and industry-standard timing options while operating from a 3.0 V to 3.6 V supply and within a 0 °C to +70 °C commercial temperature range.
Key Features
- Memory Organization 512 Mbit organized as 32M × 16, providing parallel x16 data width for system memory integration.
- Synchronous SDRAM Architecture Fully synchronous operation with pipeline architecture; all signals referenced to the positive clock edge for predictable timing.
- Performance Clock frequency up to 166 MHz for the -6 speed grade and access time of 5.4 ns (CAS latency dependent).
- Programmable Burst and CAS Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); programmable CAS latency options (2 or 3 clocks) for flexible timing.
- Refresh and Power Modes Supports Auto Refresh, Self Refresh, and standard 8K refresh cycles every 64 ms for maintained data integrity in volatile memory operation.
- Voltage Operates from 3.0 V to 3.6 V supply, compatible with standard 3.3 V system domains.
- Package 54-TFBGA (54-ball TF-BGA, supplier package 54-TW-BGA 8×13) for compact board footprint and BGA mounting.
- Operating Temperature Commercial temperature rating: 0 °C to +70 °C (TA).
Typical Applications
- Parallel system memory Use as a 512 Mbit volatile storage element where a parallel x16 SDRAM interface is required.
- Buffer memory Suitable for designs that need high-throughput burst transfers with programmable burst lengths and sequences.
- Refresh-managed memory subsystems Fits systems requiring standard Auto Refresh and Self Refresh support with 8K refresh cycles per 64 ms.
Unique Advantages
- Deterministic synchronous interface All signals referenced to clock rising edge and pipeline architecture deliver predictable timing behavior for system designers.
- Flexible performance tuning Programmable CAS latency and burst modes allow designers to match timing to system requirements and memory access patterns.
- Compact BGA footprint 54-TFBGA package enables space-efficient board layouts while supporting x16 data width.
- Standard supply range 3.0 V–3.6 V operation aligns with common 3.3 V system power domains.
- Built-in refresh management Auto Refresh and Self Refresh modes with 8K/64 ms refresh cycles reduce external refresh control complexity.
Why Choose IS42S16320D-6BL-TR?
The IS42S16320D-6BL-TR provides a compact, synchronous 512 Mbit DRAM solution with programmable burst control and CAS latency options, making it suitable for designs that require deterministic parallel memory performance. Its 54-ball TF-BGA package and standard 3.0 V–3.6 V supply range simplify integration into embedded and system-level designs that need x16 SDRAM capacity.
Engineers choosing this device benefit from a pipelined SDRAM architecture with refresh and self-refresh support, flexible timing configuration, and commercial temperature operation, offering a balance of performance and integration for applications requiring volatile parallel SDRAM storage.
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