IS42S16320B-7TLI

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 812 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16320B-7TLI – IC DRAM 512MBIT PAR 54TSOP II

The IS42S16320B-7TLI is a 512 Mbit synchronous DRAM organized as 32M × 16 with a parallel memory interface. It implements a fully synchronous, pipelined architecture with internal banks to support high-speed, predictable data transfers for systems requiring parallel SDRAM memory.

Designed for applications that require 3.0–3.6 V operation and extended temperature performance, the device is offered in a 54-pin TSOP-II package and supports programmable burst modes, auto and self-refresh, and LVTTL signaling.

Key Features

  • Memory Organization 32M × 16 organization delivering a total of 512 Mbit of synchronous DRAM capacity in a single 54‑TSOP II package.
  • Synchronous Pipeline Architecture Fully synchronous operation with all signals referenced to a positive clock edge and internal bank structure for hidden row access/precharge.
  • Performance Supported clock frequency up to 143 MHz for the -7 timing grade with an access time from clock of 5.4 ns (CAS latency = 3).
  • Burst and Latency Options Programmable burst lengths (1, 2, 4, 8, full page) and burst sequences (sequential/interleave), with selectable CAS latency (2 or 3 clocks).
  • Refresh and Power Auto Refresh and Self Refresh support with 8K refresh cycles (timing varies by grade); power supply range 3.0 V to 3.6 V compatible with 3.3 V systems.
  • Interface Parallel memory interface with LVTTL signaling for compatibility with parallel bus architectures.
  • Package and Temperature 54‑pin TSOP‑II package (0.400", 10.16 mm width) and operating temperature range of -40 °C to +85 °C (TA).

Typical Applications

  • Industrial Systems Use as system DRAM where extended temperature range (-40 °C to +85 °C) and parallel SDRAM interface are required for reliable operation.
  • Embedded Memory High-capacity parallel memory for embedded platforms that need 512 Mbit SDRAM with programmable burst modes and low-latency access.
  • Buffering and High‑Speed Data Transfer Applications that benefit from the device’s pipeline architecture, internal bank operation, and 143 MHz clock grade for predictable high-speed transfers.

Unique Advantages

  • Fixed 32M × 16 Organization: Simplifies memory mapping and board-level design by providing a consistent 512 Mbit x16 footprint in a single device.
  • Programmable Burst Control: Flexible burst lengths and sequences enable optimization for both sequential and random access patterns, reducing controller complexity.
  • Deterministic Timing: Fully synchronous operation with defined CAS latency options (2 or 3 clocks) and specified access times supports predictable system timing.
  • Standard 3.3 V Compatibility: Operates within a 3.0–3.6 V range suitable for common 3.3 V memory subsystems.
  • Robust Refresh Modes: Auto and self-refresh capabilities with supported refresh cycles help maintain data integrity across operating conditions.
  • Compact TSOP‑II Packaging: 54‑pin TSOP‑II package provides a space-efficient footprint for board-level integration.

Why Choose IS42S16320B-7TLI?

The IS42S16320B-7TLI combines a 512 Mbit SDRAM capacity with a synchronous, pipelined, quad‑bank architecture to deliver predictable timing and high-throughput parallel memory access. Its programmable burst modes, selectable CAS latency, and standard 3.0–3.6 V supply make it suitable for designs that require flexible performance tuning and straightforward integration into 3.3 V memory subsystems.

This device is well-suited to engineers and system designers building embedded and industrial platforms that need compact, high-capacity parallel DRAM with extended temperature tolerance and mature SDRAM feature set (auto/self-refresh, burst control, LVTTL interface).

For pricing, availability, or to request a quote and technical support, please contact our sales team or request a formal quote through the channel provided by your procurement process.

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