IS42S16320B-7BLI-TR
| Part Description |
IC DRAM 512MBIT PAR 54WBGA |
|---|---|
| Quantity | 711 Available (as of May 4, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-WBGA (11x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320B-7BLI-TR – IC DRAM 512Mbit PAR 54WBGA
The IS42S16320B-7BLI-TR is a 512Mbit synchronous DRAM (SDRAM) organized as 32M × 16, offering high-speed, pipelined data transfer in a compact 54-ball W‑BGA (11×13) package. It provides a parallel memory interface with LVTTL signaling and programmable burst operation to support burst read/write access patterns.
Designed for systems operating from 3.0 V to 3.6 V, the device supports clock frequencies up to 143 MHz (–7 speed grade) with programmable CAS latency and industry-grade operating temperature capability to meet a range of system requirements.
Key Features
- Core Memory The device is a 512 Mbit SDRAM organized as 32M × 16 (quad-bank architecture) for parallel access and high throughput.
- Performance Supports clock frequencies up to 143 MHz (–7), with programmable CAS latency of 2 or 3 clocks and an access time from clock of 5.4 ns (CL=3).
- Burst and Access Control Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (sequential/interleave); burst termination via burst stop or precharge commands.
- Refresh and Self‑Refresh Auto Refresh (CBR) and Self Refresh supported; 8K refresh cycle options documented (timing varies by device grade).
- Interface Parallel LVTTL-compatible interface with synchronous operation—all signals referenced to the rising clock edge.
- Power Operates from a 3.0 V to 3.6 V supply range (VDD/VDDQ nominal at 3.3 V as documented in device specifications).
- Package 54-ball W‑BGA (11×13) package for space-efficient board-level integration.
- Temperature Range Specified operating ambient temperature range of −40 °C to +85 °C (TA) for industrial applications.
Typical Applications
- Memory subsystems Embedded and board‑level memory banks requiring 512 Mbit synchronous DRAM in a compact BGA footprint.
- High-speed data buffering Systems that use pipelined SDRAM for burst read/write buffering and rapid random column access.
- Industrial electronics Designs requiring operation across an extended temperature range (−40 °C to +85 °C) and 3.3 V nominal memory supply.
Unique Advantages
- Programmable burst behavior Flexible burst lengths and sequence options allow tuning memory transfers to application access patterns and latency requirements.
- High clock-rate support –7 speed grade operation at up to 143 MHz with low access time (5.4 ns at CL=3) for responsive data access.
- Compact package 54‑ball W‑BGA (11×13) reduces board area while providing a parallel x16 interface for wide-data transfers.
- Robust refresh options Auto and self‑refresh modes with documented refresh intervals for different device grades to maintain data integrity.
- Wide supply tolerance 3.0 V to 3.6 V supply range accommodates standard 3.3 V memory systems.
Why Choose IS42S16320B-7BLI-TR?
The IS42S16320B-7BLI-TR delivers a practical balance of density, speed, and form factor for designs that require 512 Mbit of synchronous DRAM in a compact W‑BGA package. Its programmable burst modes, LVTTL parallel interface, and support for industry temperature ranges make it suitable for systems needing predictable, high-throughput memory behavior at a 3.3 V supply.
Engineers specifying this device benefit from clear timing and refresh options, selectable CAS latency, and a well‑documented feature set that supports integration into a variety of memory subsystems and embedded applications.
Request a quote or contact sales for pricing, availability, and lead-time information for IS42S16320B-7BLI-TR.