IS42S16320B-7BL-TR
| Part Description |
IC DRAM 512MBIT PAR 54WBGA |
|---|---|
| Quantity | 226 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-WBGA (11x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S16320B-7BL-TR – IC DRAM 512MBIT PAR 54WBGA
The IS42S16320B-7BL-TR is a 512Mbit synchronous DRAM (SDRAM) organized as 32M × 16 that delivers high-speed, pipeline-based data transfer for parallel memory subsystems. It implements a quad-bank architecture with a fully synchronous interface referenced to the rising clock edge.
Targeted for commercial-temperature designs, this device supports a nominal 3.3V supply and a parallel LVTTL interface, making it suitable for systems that require a compact 54-ball W‑BGA memory package and programmable burst access.
Key Features
- Core & Architecture Fully synchronous SDRAM with pipeline architecture and internal bank structure to hide row access/precharge latency.
- Memory Capacity & Organization 512 Mbit total capacity; organized as 32M × 16 (x16 data bus).
- Clocking & Timing Supports up to 143 MHz clock frequency for the -7 speed grade; access time from clock 5.4 ns (CAS latency = 3).
- Programmable Burst & CAS Programmable burst length (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); programmable CAS latency options of 2 or 3 clocks.
- Refresh & Power Management Supports Auto Refresh (CBR) and Self Refresh. 8K refresh cycles supported with timing options (e.g., 16 ms for A2 grade or 64 ms for Commercial/A1/Industrial grades as specified in the device documentation).
- Voltage & I/O Nominal VDD/VDDQ = 3.3V with a supply range listed as 3.0 V to 3.6 V; LVTTL compatible interface.
- Package & Mounting Available in a compact 54‑ball W‑BGA (11×13 mm) package (54‑TFBGA noted in documentation) for board-level memory integration.
- Operating Temperature Commercial temperature range: 0°C to +70°C (TA).
Typical Applications
- Parallel memory subsystems For designs requiring a 32M × 16 organization and a parallel LVTTL SDRAM interface at 3.3V.
- Board-level DRAM expansion Compact 54‑ball W‑BGA package enables high-density memory placement on system PCBs.
- Commercial embedded systems Suited for commercial-temperature equipment needing 512 Mbit of synchronous DRAM capacity with programmable burst modes.
Unique Advantages
- Flexible burst and timing options: Programmable burst lengths and CAS latency settings let designers tune throughput and latency to application needs.
- High-speed synchronous operation: Pipeline architecture and support for 143 MHz operation (‑7 grade) provide low-latency access, with 5.4 ns access time at CL=3.
- Industry-standard voltage support: Nominal 3.3V VDD/VDDQ with an allowed supply range of 3.0–3.6V simplifies integration into common memory power domains.
- Compact package footprint: 54‑ball W‑BGA (11×13) saves board space while providing a x16 interface for wider data paths.
- Built-in refresh management: Auto Refresh and Self Refresh support reduces external refresh handling and helps maintain data integrity across power modes.
Why Choose IS42S16320B-7BL-TR?
The IS42S16320B-7BL-TR combines a 512 Mbit SDRAM capacity with a synchronous, pipeline architecture and programmable timing features that suit parallel 3.3V memory designs. Its x16 organization, selectable burst modes, and compact 54‑ball W‑BGA footprint make it a practical choice when board space and bus width are important design considerations.
This device is appropriate for commercial-temperature systems that require predictable timing (CL = 2 or 3), self‑refresh capability, and standard LVTTL signaling. It is a straightforward option for engineers seeking a 512Mbit parallel SDRAM solution with documented timing and refresh behavior.
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