IS42S16320B-7BLI

IC DRAM 512MBIT PAR 54WBGA
Part Description

IC DRAM 512MBIT PAR 54WBGA

Quantity 101 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-WBGA (11x13)Memory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S16320B-7BLI – IC DRAM 512Mbit PAR 54WBGA

The IS42S16320B-7BLI is a 512Mbit synchronous DRAM organized as 32M × 16, implementing a pipelined architecture for high-speed data transfer. It is a fully synchronous parallel DRAM with internal banks, programmable burst operation and CAS latency options, designed for systems that require fast, temporary data storage and predictable clock-referenced operation.

This device supports clocked operation up to 143 MHz for the -7 speed grade, an access time of 5.4 ns (CAS latency = 3), and operates from a 3.0 V to 3.6 V supply. It is offered in a compact 54-ball W‑BGA (11 × 13) package and is specified for an extended operating temperature range of -40°C to +85°C (TA).

Key Features

  • Core & Architecture  Fully synchronous SDRAM with pipeline architecture and internal bank structure to optimize row access and precharge behavior.
  • Memory Organization & Capacity  512 Mbit capacity organized as 32M × 16, providing wide parallel data paths for system memory buffering.
  • Performance  Clock frequency options include 166, 143 and 133 MHz (143 MHz for the -7 grade); access time of 5.4 ns at CAS latency = 3.
  • Programmable Burst & Latency  Programmable burst lengths (1, 2, 4, 8, full page) and burst sequences (sequential/interleave), with selectable CAS latency of 2 or 3 clocks.
  • Refresh & Self-Refresh  Auto Refresh (CBR) and Self Refresh supported; refresh options include 8K cycles per 16 ms (A2 grade) or 64 ms (Commercial/Industrial/A1 grades).
  • Interface  LVTTL-compatible interface with all signals referenced to the rising edge of the clock for deterministic timing.
  • Power & Voltage  Designed for VDD / VDDQ nominal 3.3 V operation with an allowable supply range of 3.0 V to 3.6 V.
  • Package & Temperature Range  Available in a 54-ball W‑BGA (11 × 13) package (54-TFBGA) and specified for operation from -40°C to +85°C (TA).

Typical Applications

  • Embedded systems memory buffering  Use as high-speed temporary storage in systems that require clocked synchronous access and burst transfers.
  • High-throughput data buffers  Suitable for designs needing wide parallel data paths (x16 organization) and programmable burst control for block transfers.
  • Industrial electronics  Operation to -40°C supports deployment in industrial temperature environments requiring reliable SDRAM performance.

Unique Advantages

  • Deterministic synchronous operation: All signals referenced to the positive clock edge enable predictable timing and simplified system integration.
  • Flexible burst control: Programmable burst lengths and sequences plus selectable CAS latency allow tuning for varied access patterns and throughput needs.
  • Extended temperature support: Specified operation from -40°C to +85°C (TA) addresses temperature-demanding deployments.
  • Compact, board-friendly package: 54-ball W‑BGA (11 × 13) provides a small footprint for space-constrained designs while offering x16 data width.
  • Built-in refresh modes: Auto Refresh and Self Refresh with supported refresh-cycle options reduce external refresh management overhead.
  • Standard 3.3 V signaling with flexible supply range: VDD/VDDQ nominal 3.3 V with an allowable 3.0 V to 3.6 V window for compatibility with common system power rails.

Why Choose IS42S16320B-7BLI?

The IS42S16320B-7BLI is positioned for designs that require a reliable, 512 Mbit synchronous DRAM with predictable, clock-referenced operation and flexible burst control. Its 32M × 16 organization, pipelined architecture and support for up to 143 MHz (–7) combine to deliver high-speed parallel data buffering in a compact 54-ball W‑BGA package.

This device is suitable for engineers specifying SDRAM for embedded and industrial systems that need selectable CAS latency, programmatic burst behavior, and built-in refresh management, all supported across an extended temperature range. The combination of performance, interface standardization, and package density provides long-term design scalability and integration simplicity.

If you need pricing, lead-time or availability details for IS42S16320B-7BLI, request a quote or submit an inquiry and our team will provide the information you need.

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