IS42S16320B-7TLI-TR

The IS42S16320B-7TLI-TR is a 512Mbit synchronous DRAM organized as 32M × 16 with a parallel memory interface in a 54-pin TSOP-II package. It implements a pipelined, fully synchronous architecture with all signals referenced to the rising edge of the clock.

Designed for systems that require compact, board-level 512Mbit SDRAM, the device delivers high-speed operation (supported clock frequencies include 143 MHz for the -7 timing) with programmable CAS latency and built-in refresh modes to maintain data integrity across a wide operating temperature range.

Key Features

• Core / Architecture  Quad-bank, pipelined synchronous DRAM architecture with all inputs/outputs referenced to the rising clock edge for deterministic timing.
• Memory  512 Mbit capacity organized as 32M × 16, providing parallel x16 data width for board-level memory expansion.
• Performance / Timing  Supports clock frequencies including 143 MHz for the -7 device and programmable CAS latency (2 or 3 clocks). Access time from clock is 5.4 ns at CL = 3.
• Burst and Sequencing  Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (sequential or interleave) for flexible data transfer patterns.
• Refresh and Retention  Auto Refresh (CBR) and Self Refresh supported; refresh options include 8K cycles per 16 ms (A2 grade) or per 64 ms (Commercial/Industrial/A1 grade) as defined in the device family.
• Interface / Logic Levels  LVTTL-compatible interface for control signals and random column addressing every clock cycle for efficient column access.
• Power  Operates from a 3.0 V to 3.6 V supply range (device family nominal 3.3 V VDD/VDDQ).
• Package & Mounting  54-pin TSOP-II package (0.400" / 10.16 mm width) optimized for compact board-level mounting.
• Temperature Range  Rated for operation from -40 °C to +85 °C (TA), supporting designs that require an industrial temperature range.

Typical Applications

• Parallel memory subsystems  Used where a 512Mbit parallel SDRAM device is required for board-level memory expansion or legacy parallel-memory interfaces.
• Compact board-level memory  TSOP-II 54-pin package provides a dense form factor for space-constrained PCBs requiring x16 memory.
• Industrial temperature designs  Suitable for systems that must operate across -40 °C to +85 °C ambient conditions.

Unique Advantages

• Deterministic synchronous operation: Fully synchronous design with all signals referenced to clock edge simplifies timing analysis and system integration.
• Configurable latency and burst modes: Programmable CAS latency and multiple burst length/sequence options enable tuning for throughput and access patterns.
• Built-in refresh management: Auto and self-refresh capability plus defined refresh cycles support stable data retention without external refresh logic.
• Wide supply tolerance: 3.0 V to 3.6 V operating range accommodates 3.3 V memory systems and board-level voltage variations.
• Industrial temperature support: Rated for -40 °C to +85 °C operation for reliable performance in temperature-sensitive deployments.
• Compact TSOP-II packaging: 54-pin TSOP-II (10.16 mm width) offers a small footprint for high-density memory implementations.

Why Choose IS42S16320B-7TLI-TR?

The IS42S16320B-7TLI-TR provides a straightforward, board-level 512Mbit SDRAM solution combining a x16 parallel interface, programmable timing/burst flexibility, and synchronous pipelined operation. Its specification set — including 143 MHz operation for the -7 timing, 5.4 ns access time at CL = 3, and industry-grade temperature range — makes it well-suited to designs that need compact, high-speed parallel DRAM in a TSOP-II footprint.

This device is appropriate for engineers and procurement teams seeking a verified 512Mbit SDRAM device with explicit timing, refresh options, and a narrow supply range for integration into existing 3.3 V memory systems.

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