IS42S16400D-7BL-TR

IC DRAM 64MBIT PAR 60MINIBGA
Part Description

IC DRAM 64MBIT PAR 60MINIBGA

Quantity 179 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-MiniBGA (6.4x10.1)Memory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16400D-7BL-TR – IC DRAM 64MBIT PAR 60MINIBGA

The IS42S16400D-7BL-TR is a 64‑Mbit synchronous DRAM organized as 1,048,576 bits × 16 × 4 banks (64‑Mbit) designed for high‑speed, burst‑oriented memory applications. It implements a fully synchronous pipeline architecture with internal bank interleaving to improve random access throughput in 3.3 V memory systems.

Targeted at systems requiring parallel SDRAM in a compact BGA package, the device offers programmable burst operation, selectable CAS latency, and multiple power‑management modes to balance performance and power consumption.

Key Features

  • Memory Architecture – Organized as 1,048,576 × 16 × 4 banks (64‑Mbit) with internal bank interleaving and pipeline architecture for high‑speed burst transfers.
  • Synchronous SDRAM Core – Fully synchronous operation with all signals referenced to the rising edge of CLK and LVTTL‑compatible inputs/outputs.
  • Clock and Timing – Rated clock frequency listed at 143 MHz with programmable CAS latency of 2 or 3 clocks and an access time of 5.4 ns.
  • Burst and Addressing – Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (sequential or interleave); supports random column address changes every clock cycle.
  • Power and Refresh – Single 3.3 V power supply (3.0–3.6 V range), AUTO REFRESH and SELF REFRESH modes, and 4,096 refresh cycles every 64 ms; includes power‑down capability.
  • Byte Control and I/O – Byte masking via LDQM and UDQM; VDDQ and GNDQ separate power/ground for DQ pins.
  • Package Options – Available in a 60‑ball fBGA / 60‑MiniBGA (6.4 × 10.1 mm) package; also offered in 54‑pin TSOP II format.
  • Operating Range – Specified operating ambient temperature range of 0 °C to 70 °C (TA).

Typical Applications

  • Embedded Systems – Acts as parallel SDRAM for microcontroller or FPGA‑based designs requiring burst reads/writes and banked access.
  • Consumer Electronics – Suitable for devices using 3.3 V SDRAM for frame buffers, temporary data storage, or buffering tasks.
  • Networking and Communications Modules – Useful where synchronous burst transfers and internal bank interleaving improve throughput for packet buffering.

Unique Advantages

  • Quad‑Bank Interleaving: Internal four‑bank architecture hides row precharge cycles and enables higher effective throughput during random access patterns.
  • Flexible Burst Control: Programmable burst lengths and sequence modes let designers optimize for sequential or interleaved access patterns.
  • Low‑Level I/O Control: LDQM and UDQM byte masks and separate VDDQ/GNDQ rails provide control over data byte lanes and I/O power domains.
  • Power Management Modes: AUTO REFRESH, SELF REFRESH, and power‑down modes help manage refresh and standby power in 3.3 V systems.
  • Compact Package: Available in a 60‑ball miniBGA (6.4 × 10.1 mm) for space‑constrained boards while maintaining a parallel SDRAM interface.

Why Choose IS42S16400D-7BL-TR?

The IS42S16400D-7BL-TR delivers a straightforward, fully synchronous 64‑Mbit SDRAM option with quad‑bank architecture, flexible burst operation, and standard 3.3 V interfacing. Its combination of programmable timing (CAS latency), burst control, and power‑management modes makes it suitable for designs that need predictable, burst‑oriented memory behavior in a compact BGA footprint.

This device is well suited for engineers specifying parallel SDRAM in embedded, consumer, or communication products who require clear electrical and timing characteristics and a compact package option for board‑level integration.

For pricing, lead time, or to request a quote for IS42S16400D-7BL-TR, please submit a quote request or contact our sales team for assistance.

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