IS42S16400F-7TLI

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 1,195 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16400F-7TLI – IC DRAM 64MBIT PAR 54TSOP II

The IS42S16400F-7TLI is a 64 Mbit synchronous DRAM organized as 1,048,576 × 16 × 4 banks. It implements a pipeline, fully synchronous architecture with all signals referenced to the rising edge of the clock to support high-speed parallel memory operations.

Designed for systems requiring fast parallel SDRAM with flexible burst and timing options, this device offers industry-grade operating temperature range and a compact 54-pin TSOP II package for space-constrained applications.

Key Features

  • Core / Memory Organization  64 Mbit density organized as 4M × 16 with 4 internal banks to improve throughput and hide row access/precharge latency.
  • Timing & Performance  Supports clock frequencies up to 143 MHz for the -7 speed grade with CAS latency options (2 or 3 clocks) and an access time from clock of 5.4 ns at CL=3.
  • Programmable Burst & Sequence  Programmable burst length (1, 2, 4, 8, full page) and selectable sequential or interleave burst sequences for flexible data transfer patterns.
  • Refresh & Retention  Auto refresh (CBR) and self-refresh modes supported; 4096 refresh cycles per 64 ms for commercial/industrial/A1 grades (A2 grade uses 16 ms).
  • Interface & Logic Levels  LVTTL-compatible interface with fully synchronous control referenced to a single positive-edge clock input.
  • Power  Single 3.3 V supply range (3.0 V to 3.6 V) for standard SDRAM system integration.
  • Package & Temperature  54-pin TSOP II package (0.400", 10.16 mm width) and an operating temperature range of -40°C to +85°C (TA) for industrial applications.

Typical Applications

  • Industrial Systems  The -40°C to +85°C operating range and parallel SDRAM interface make it suitable for industrial control and embedded applications that require reliable memory at extended temperatures.
  • Embedded Memory Expansion  Provides a compact, high-speed parallel memory option for embedded designs needing 64 Mbit SDRAM capacity and flexible burst operation.
  • High‑Speed Data Buffering  The 4-bank architecture and programmable burst modes support applications that require predictable, high-throughput buffering and burst transfers.

Unique Advantages

  • Flexible Timing Options: Programmable CAS latency (2 or 3 clocks) and selectable burst lengths let designers tune latency and throughput to match system timing.
  • Single 3.3 V Supply: Standard 3.0–3.6 V supply simplifies power rails and integration with common system logic levels.
  • Compact TSOP II Package: 54-pin TSOP II (10.16 mm width) delivers a small footprint for space-sensitive board designs.
  • Built‑in Refresh Management: Auto refresh and self-refresh modes with defined refresh cycles reduce system refresh overhead and support low-power retention scenarios.
  • Deterministic Synchronous Operation: Fully synchronous design with LVTTL interface and positive-edge clock reference supports predictable, pipelined memory transfers.
  • Industrial Temperature Rating: Operation from -40°C to +85°C (TA) addresses a broad range of non-automotive industrial environments.

Why Choose IS42S16400F-7TLI?

The IS42S16400F-7TLI combines a 64 Mbit density with a fully synchronous, pipelined SDRAM architecture and flexible programmability for burst length and CAS latency. Its single 3.3 V supply, LVTTL interface, and 4-bank organization provide a balance of performance and integration for parallel-memory designs that require predictable timing and high-throughput buffering.

This device is particularly well suited to designers targeting industrial-grade embedded systems and compact boards that need a reliable, documented SDRAM solution with configurable timing and refresh behavior.

Request a quote or submit an inquiry for pricing and availability to initiate evaluation and procurement.

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