IS42S32160F-7BLI
| Part Description |
IC DRAM 512MBIT PAR 90TFBGA |
|---|---|
| Quantity | 28 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S32160F-7BLI - 512Mbit Parallel SDRAM
The IS42S32160F-7BLI is a 512-megabit synchronous dynamic random access memory (SDRAM) from ISSI, Integrated Silicon Solution Inc, designed for high-performance embedded applications. Organized as 16M x 32 with a parallel interface, this SDRAM delivers fast data access with a 5.4ns access time and 143MHz clock frequency. Ideal for industrial, communications, and computing systems requiring substantial volatile memory capacity with reliable operation across extended temperature ranges.
Key Features
- High-Density Memory Architecture - 512-megabit capacity organized as 16M x 32, providing ample memory for data-intensive embedded applications while maintaining efficient access patterns.
- Fast Performance Specifications - 143MHz clock frequency with 5.4ns access time enables responsive data handling for real-time processing and buffering applications.
- Standard Parallel Interface - Conventional parallel SDRAM interface simplifies integration with existing embedded processor architectures and memory controllers.
- Wide Operating Voltage Range - 3V to 3.6V supply voltage accommodates standard embedded system power rails without requiring additional voltage regulation.
- Extended Temperature Operation - -40°C to 85°C operating range ensures reliable performance in industrial environments with varying thermal conditions.
- Compact TFBGA Packaging - 90-pin TFBGA (8x13mm) package provides space-efficient board layout for designs with constrained PCB area.
Typical Applications
- Industrial Control Systems - This SDRAM provides essential volatile memory for programmable logic controllers and industrial automation equipment where the extended temperature range supports operation in factory floor environments.
- Network and Communications Equipment - The 512-megabit capacity and fast access time make this memory suitable for routers, switches, and communications processors that require substantial buffering for packet processing and data handling.
- Embedded Computing Platforms - The parallel interface and standard SDRAM architecture integrate seamlessly with embedded processors in single-board computers and industrial PCs requiring reliable system memory.
- Test and Measurement Instruments - High-speed data acquisition systems benefit from the fast access time and adequate capacity for capturing and processing measurement data in real-time applications.
- Medical Devices - Diagnostic and monitoring equipment utilize this memory for data buffering and processing where the industrial temperature rating supports medical facility environments.
Unique Advantages
- Proven SDRAM Technology: Standard synchronous DRAM architecture ensures broad compatibility with existing memory controllers and reduces design risk with well-established interface protocols.
- Simplified Design Integration: Conventional parallel interface eliminates the need for complex serial protocol implementations, reducing firmware development time and system complexity.
- Industrial-Grade Reliability: Extended temperature specification from -40°C to 85°C enables deployment in harsh industrial environments without requiring additional thermal management.
- Cost-Effective Memory Solution: Mature SDRAM technology and standard packaging reduce component costs while delivering adequate performance for applications not requiring cutting-edge memory speeds.
- Flexible System Design: Wide supply voltage tolerance from 3V to 3.6V accommodates variations in power supply regulation and simplifies power distribution design.
- Space-Efficient Form Factor: TFBGA packaging minimizes board footprint compared to larger TSOP packages, enabling denser PCB layouts in space-constrained designs.
Why Choose IS42S32160F-7BLI?
The IS42S32160F-7BLI represents a reliable and cost-effective memory solution for embedded systems requiring substantial volatile memory capacity with industrial-grade temperature performance. Its standard parallel SDRAM interface ensures straightforward integration with established processor platforms, while the 512-megabit capacity addresses the needs of data-intensive applications without over-specifying for cost-sensitive designs. The extended temperature range from -40°C to 85°C positions this memory for demanding industrial environments where consumer-grade components may not provide adequate reliability.
This SDRAM is particularly well-suited for industrial control, communications infrastructure, and embedded computing applications where proven technology and design simplicity take priority over cutting-edge performance metrics. Engineers designing systems with moderate memory bandwidth requirements will find the combination of adequate speed, industrial temperature rating, and compact packaging enables robust system architectures with predictable cost structures.
Get Started with IS42S32160F-7BLI
Contact our sales team to request a quote for the IS42S32160F-7BLI or discuss your specific memory requirements. Our technical support staff can assist with integration guidance, reference designs, and volume pricing to help you meet your project timeline and budget goals.