IS42S32160F-7TL
| Part Description |
IC DRAM 512MBIT PAR 86TSOP II |
|---|---|
| Quantity | 249 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S32160F-7TL – IC DRAM 512MBIT PAR 86TSOP II
The IS42S32160F-7TL from ISSI is a 512 Mbit volatile SDRAM organized as 16M × 32 with a parallel memory interface. It delivers synchronous DRAM functionality with a rated clock frequency of 143 MHz and an access time of 5.4 ns.
Designed for board-level memory implementations, this device offers standard SDRAM performance in an 86‑TSOP II (86‑TFSOP, 10.16 mm width) package and operates from a 3.0 V to 3.6 V supply over an ambient temperature range of 0 °C to 70 °C.
Key Features
- Memory Type & Capacity 512 Mbit volatile SDRAM organized as 16M × 32, suitable for parallel DRAM memory requirements.
- Performance Rated clock frequency of 143 MHz with an access time of 5.4 ns for latency-sensitive board designs.
- Interface Parallel memory interface for direct integration into systems that support parallel SDRAM signaling.
- Power Operates from a 3.0 V to 3.6 V supply range, compatible with standard 3.3 V systems.
- Package & Mounting Supplied in an 86‑TSOP II (86‑TFSOP, 0.400", 10.16 mm width) package for surface-mount board assembly.
- Operating Temperature Specified ambient range of 0 °C to 70 °C (TA) for general-purpose commercial applications.
Typical Applications
- Board-Level Memory Expansion Used where a 512 Mbit parallel SDRAM is required for additional system memory on PCBs and modules.
- Embedded Systems Suitable for embedded designs needing a parallel SDRAM device with 16M × 32 organization and a 3.0–3.6 V supply.
- Consumer and Commercial Electronics Applicable in devices operating within a 0 °C to 70 °C ambient range that require synchronous DRAM performance.
Unique Advantages
- High-density 512 Mbit capacity: Provides substantial memory in a single 16M × 32 DRAM device for systems with moderate memory requirements.
- Synchronous SDRAM timing: 143 MHz clock rating and 5.4 ns access time enable predictable, synchronous memory transactions.
- Standard 3.0–3.6 V supply: Compatible with common 3.3 V system power rails, simplifying power design and integration.
- Surface-mount 86‑TSOP II package: Compact 86‑TFSOP form factor (10.16 mm width) for efficient board layout and automated assembly.
- Parallel interface simplicity: Direct parallel SDRAM connection supports conventional memory controller architectures.
Why Choose IS42S32160F-7TL?
The IS42S32160F-7TL positions itself as a straightforward, high-density parallel SDRAM option for designs that require 512 Mbit of volatile memory with synchronous performance. Its specified 143 MHz clock capability, 5.4 ns access time, and 16M × 32 organization make it suitable for systems that need predictable SDRAM timing and a standard 3.0–3.6 V supply.
This device is appropriate for engineers specifying board-level memory expansions or embedded applications operating within a 0 °C to 70 °C ambient range and looking for a compact 86‑TSOP II package solution from ISSI.
If you need pricing, availability, or technical evaluation support for the IS42S32160F-7TL, request a quote or contact sales to discuss your requirements and lead times.