IS42S32400F-7BLI-TR
| Part Description |
IC DRAM 128MBIT PAR 90TFBGA |
|---|---|
| Quantity | 593 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400F-7BLI-TR – IC DRAM 128MBIT PAR 90TFBGA
The IS42S32400F-7BLI-TR is a 128 Mbit volatile SDRAM organized as 4M × 32 with a parallel memory interface. It is delivered in a 90‑TFBGA (8 × 13) package and operates from a 3.0 V to 3.6 V supply.
With a specified clock frequency of 143 MHz, an access time of 5.4 ns and an operating ambient temperature range of -40°C to 85°C, this device is intended for applications requiring external parallel DRAM storage in standard commercial and industrial temperature ranges.
Key Features
- Memory Core 128 Mbit SDRAM organized as 4M × 32, providing a 32‑bit wide memory organization for parallel data transfers.
- Performance Clock frequency rated to 143 MHz with an access time of 5.4 ns, enabling deterministic read/write timing for parallel DRAM applications.
- Interface Parallel memory interface suitable for systems designed to use external DRAM in a parallel topology.
- Power Operating supply voltage range of 3.0 V to 3.6 V to match common 3 V DRAM power rails.
- Package 90‑TFBGA package (8 × 13 ball array) for surface-mount assembly and compact board-level integration.
- Temperature Range Rated for operation from -40°C to 85°C (TA), supporting a range of ambient operating conditions.
- Memory Format Volatile DRAM device designed for external system memory expansion and buffering.
Typical Applications
- Embedded Systems Provides 128 Mbit of parallel SDRAM capacity where external DRAM is required for program data or system buffers.
- Consumer and Commercial Electronics Used as external memory in devices that implement parallel SDRAM interfaces and require moderate-density storage.
- Industrial Equipment Suitable for equipment operating within -40°C to 85°C that requires a 3.0–3.6 V parallel DRAM solution.
Unique Advantages
- 32‑bit Memory Organization: The 4M × 32 arrangement provides a 32‑bit wide data path for parallel transfers and straightforward bus integration.
- Defined Timing Performance: 143 MHz clock rating and 5.4 ns access time give concrete timing targets for system memory design and timing closure.
- Wide Supply Range: 3.0 V to 3.6 V operation aligns with common 3 V DRAM power rails for compatibility with standard system power domains.
- Compact Ball‑Grid Package: The 90‑TFBGA (8 × 13) package provides a surface-mount form factor for space-constrained PCBs.
- Extended Ambient Range: Rated for -40°C to 85°C operation to cover a broad set of non‑automotive environmental requirements.
Why Choose IS42S32400F-7BLI-TR?
The IS42S32400F-7BLI-TR delivers a clearly specified 128 Mbit SDRAM option with 4M × 32 organization, defined timing (143 MHz clock, 5.4 ns access), and a 90‑TFBGA package for compact board integration. Its 3.0–3.6 V supply range and -40°C to 85°C ambient rating make it a practical choice for designs that require a parallel DRAM memory device with documented electrical and thermal operating points.
This device is suited to engineers and procurement teams implementing external parallel DRAM in embedded, commercial, or industrial systems where verified memory size, organization, timing, package, and supply requirements are needed for system design and sourcing.
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