IS42S81600D-7TL-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,277 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600D-7TL-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S81600D-7TL-TR is a 128 Mbit synchronous DRAM (SDRAM) organized as 16M x 8 with a parallel memory interface in a 54-pin TSOP II package. It implements a quad-bank architecture and fully synchronous operation referenced to the rising edge of the system clock.

Designed for board-level memory integration, this volatile SDRAM offers programmable burst operation, internal bank interleaving and refresh management to support high-speed, pipelined data transfers in 3.0 V–3.6 V memory systems with an operating temperature range of 0°C to 70°C.

Key Features

  • Memory Core  128 Mbit SDRAM organized as 16M × 8 (4M × 8 × 4 banks) for quad-bank operation and high-density board-level memory.
  • Synchronous Interface & Timing  Fully synchronous operation with LVTTL I/O; specified for 143 MHz clock operation (device -7 timing) and access time from clock of 5.4 ns.
  • Programmable Burst & CAS  Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (Sequential/Interleave); programmable CAS latency options (2, 3 clocks).
  • Refresh and Power Management  Auto Refresh (CBR), Self Refresh with programmable refresh periods and 4096 refresh cycles every 64 ms to maintain data integrity.
  • Power  Supply range listed as 3.0 V to 3.6 V (VDD/VDDQ shown as 3.3 V in device documentation).
  • Package  54-pin TSOP II (0.400", 10.16 mm width) surface-mount package suitable for board-level mounting.
  • Operating Temperature  Specified ambient operating range 0°C to 70°C (TA).

Typical Applications

  • Board-level system memory  Use as high-density SDRAM for systems requiring parallel synchronous memory in a 3.0 V–3.6 V environment.
  • Embedded processing platforms  Supports pipelined, burst-oriented read/write transfers and bank interleaving for embedded systems with burst-access workloads.
  • Memory expansion modules  Suitable for compact module designs that require a 54-pin TSOP II package and standard SDRAM refresh/management features.

Unique Advantages

  • Quad-bank architecture: Internal bank structure enables precharge hiding and interleaved access to improve effective throughput during burst operations.
  • Flexible burst operation: Programmable burst lengths and sequence modes allow tuning for sequential or interleaved access patterns, reducing host-side address management.
  • Deterministic timing: Documented timing options including CAS latency settings and a 5.4 ns access time (at -7 timing) support predictable system design at 143 MHz.
  • Built-in refresh controls: Auto Refresh and Self Refresh modes with defined refresh rates (4096 cycles per 64 ms) simplify system refresh management and power optimization.
  • Compact board footprint: 54-pin TSOP II package (10.16 mm width) provides a high-density memory solution for space-constrained PCBs.

Why Choose IS42S81600D-7TL-TR?

The IS42S81600D-7TL-TR delivers a compact, synchronous 128 Mbit DRAM solution that combines quad-bank architecture, programmable burst modes and documented timing for reliable board-level memory integration. Its 54-pin TSOP II package and support for standard SDRAM refresh and CAS options make it suitable for embedded platforms and memory expansion designs that require deterministic, high-speed parallel memory.

This device is positioned for designers who need a verified SDRAM building block with clear electrical and timing specifications, enabling predictable integration into 3.0 V–3.6 V systems operating within the specified 0°C to 70°C ambient range.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for IS42S81600D-7TL-TR. Provide your desired quantities and delivery requirements for a formal response.

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