IS42S81600E-6TL-TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,746 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S81600E-6TL-TR – IC DRAM 128MBIT PAR 54TSOP II
The IS42S81600E-6TL-TR is a 128 Mbit synchronous DRAM organized as 16M × 8 with a parallel memory interface. It implements a quad-bank, fully synchronous architecture with pipeline operation and LVTTL-referenced signals for high-speed, clocked data transfer.
Targeted at systems requiring compact, board-mount DRAM, this device delivers up to 166 MHz operation with programmable burst modes and CAS latency options, while operating from a 3.0 V to 3.6 V supply and housed in a 54-pin TSOP II package.
Key Features
- Memory Architecture 128 Mbit capacity organized as 16M × 8 with four internal banks to enable pipelined access and hidden row operations.
- Synchronous DRAM Core Fully synchronous operation with all inputs and outputs referenced to the positive clock edge; LVTTL interface for command and data signals.
- Performance / Timing Speed grade -6 supports 166 MHz clock frequency with an access time from clock of 5.4 ns (CAS latency = 3).
- Programmable Burst and CAS Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); selectable CAS latency of 2 or 3 clocks.
- Refresh and Power Modes Supports Auto Refresh (CBR) and Self Refresh with 4096 refresh cycles every 64 ms; includes power-down capability for lower standby consumption.
- Supply and Signal Levels Designed for 3.3 V VDD / VDDQ operation (3.0 V to 3.6 V supply range) with LVTTL-compatible signaling.
- Package and Temperature Available in a 54-pin TSOP II (0.400", 10.16 mm width) package; specified operating ambient temperature 0 °C to 70 °C.
Typical Applications
- Embedded system memory Serves as board-level DRAM for designs that require a 128 Mbit parallel SDRAM device with selectable burst and CAS settings.
- Consumer and compact electronics Provides synchronous DRAM storage in space-constrained assemblies using the 54-pin TSOP II package.
- General purpose memory expansion Suitable for systems that need a reliable 3.3 V parallel SDRAM interface with support for auto and self refresh.
Unique Advantages
- Quad-bank pipelined architecture: Enables overlapping row operations to improve effective throughput for burst accesses.
- Programmable latency and burst modes: Flexible CAS latency (2 or 3) and multiple burst length/sequence options allow tuning for target system timing and access patterns.
- Wide operating supply range: 3.0 V to 3.6 V support aligns with common 3.3 V system rails for straightforward integration.
- Compact TSOP II package: 54-pin TSOP II footprint provides a small board area solution for high-density memory placement.
- Built-in refresh and low-power modes: Auto Refresh, Self Refresh and power-down modes simplify system refresh handling and reduce standby power.
Why Choose IS42S81600E-6TL-TR?
The IS42S81600E-6TL-TR combines a compact 54-pin TSOP II package with a fully synchronous, quad-bank SDRAM architecture to deliver configurable performance up to 166 MHz and 128 Mbit density. Its programmable CAS latency, burst control and built-in refresh modes make it a practical choice for board-level memory implementations where predictable timing and flexibility are required.
This device is suited to designers and procurement teams specifying parallel SDRAM for compact systems that operate on standard 3.3 V rails and require a reliable, documented memory component with commercial temperature range specifications.
Request a quote or contact sales to discuss availability, lead times and pricing for the IS42S81600E-6TL-TR or to obtain the full device datasheet and technical support information.