IS42S81600E-6TL-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,746 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600E-6TL-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S81600E-6TL-TR is a 128 Mbit synchronous DRAM organized as 16M × 8 with a parallel memory interface. It implements a quad-bank, fully synchronous architecture with pipeline operation and LVTTL-referenced signals for high-speed, clocked data transfer.

Targeted at systems requiring compact, board-mount DRAM, this device delivers up to 166 MHz operation with programmable burst modes and CAS latency options, while operating from a 3.0 V to 3.6 V supply and housed in a 54-pin TSOP II package.

Key Features

  • Memory Architecture  128 Mbit capacity organized as 16M × 8 with four internal banks to enable pipelined access and hidden row operations.
  • Synchronous DRAM Core  Fully synchronous operation with all inputs and outputs referenced to the positive clock edge; LVTTL interface for command and data signals.
  • Performance / Timing  Speed grade -6 supports 166 MHz clock frequency with an access time from clock of 5.4 ns (CAS latency = 3).
  • Programmable Burst and CAS  Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); selectable CAS latency of 2 or 3 clocks.
  • Refresh and Power Modes  Supports Auto Refresh (CBR) and Self Refresh with 4096 refresh cycles every 64 ms; includes power-down capability for lower standby consumption.
  • Supply and Signal Levels  Designed for 3.3 V VDD / VDDQ operation (3.0 V to 3.6 V supply range) with LVTTL-compatible signaling.
  • Package and Temperature  Available in a 54-pin TSOP II (0.400", 10.16 mm width) package; specified operating ambient temperature 0 °C to 70 °C.

Typical Applications

  • Embedded system memory  Serves as board-level DRAM for designs that require a 128 Mbit parallel SDRAM device with selectable burst and CAS settings.
  • Consumer and compact electronics  Provides synchronous DRAM storage in space-constrained assemblies using the 54-pin TSOP II package.
  • General purpose memory expansion  Suitable for systems that need a reliable 3.3 V parallel SDRAM interface with support for auto and self refresh.

Unique Advantages

  • Quad-bank pipelined architecture: Enables overlapping row operations to improve effective throughput for burst accesses.
  • Programmable latency and burst modes: Flexible CAS latency (2 or 3) and multiple burst length/sequence options allow tuning for target system timing and access patterns.
  • Wide operating supply range: 3.0 V to 3.6 V support aligns with common 3.3 V system rails for straightforward integration.
  • Compact TSOP II package: 54-pin TSOP II footprint provides a small board area solution for high-density memory placement.
  • Built-in refresh and low-power modes: Auto Refresh, Self Refresh and power-down modes simplify system refresh handling and reduce standby power.

Why Choose IS42S81600E-6TL-TR?

The IS42S81600E-6TL-TR combines a compact 54-pin TSOP II package with a fully synchronous, quad-bank SDRAM architecture to deliver configurable performance up to 166 MHz and 128 Mbit density. Its programmable CAS latency, burst control and built-in refresh modes make it a practical choice for board-level memory implementations where predictable timing and flexibility are required.

This device is suited to designers and procurement teams specifying parallel SDRAM for compact systems that operate on standard 3.3 V rails and require a reliable, documented memory component with commercial temperature range specifications.

Request a quote or contact sales to discuss availability, lead times and pricing for the IS42S81600E-6TL-TR or to obtain the full device datasheet and technical support information.

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