IS42S81600E-6TLI-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 656 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600E-6TLI-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S81600E-6TLI-TR is a 128 Mbit synchronous DRAM organized as 16M × 8 with a parallel interface and a 54-pin TSOP II package. It uses a pipelined, fully synchronous architecture with internal banking to support high-speed data transfer referenced to the rising clock edge.

Designed for systems that require a 128 Mbit SDRAM operating at 3.3 V nominal (3.0–3.6 V supply range) and industrial temperature capability (−40 °C to 85 °C), the device supports programmable burst modes, CAS latency options, and multiple refresh and power-management modes to fit a range of board-level memory subsystems.

Key Features

  • Core & Architecture  128 Mbit SDRAM configured as 16M × 8 with quad-bank organization and pipeline architecture; all signals registered on the rising edge of CLK.
  • Performance  Supports a 166 MHz clock frequency (‑6 speed grade) with 5.4 ns access time (CAS‑latency = 3) for high-speed synchronous operation.
  • Programmable Burst and Timing  Programmable burst lengths (1, 2, 4, 8, full page), sequential or interleave burst sequences, and selectable CAS latency (2 or 3 clocks) for flexible data-transfer tuning.
  • Refresh & Power Management  Auto Refresh (CBR), Self Refresh and power-down modes supported; 4096 refresh cycles every 64 ms as specified for data retention.
  • Interface & Logic Levels  Parallel memory interface with LVTTL signalling for command and control paths.
  • Voltage & Supply  Nominal 3.3 V operation with a supply range of 3.0 V to 3.6 V; VDD and VDDQ designed for 3.3 V systems.
  • Package & Temperature  54-pin TSOP II package (0.400", 10.16 mm width) and industrial operating temperature range of −40 °C to 85 °C for extended environmental tolerance.

Typical Applications

  • Industrial Control Systems  Memory buffering and system memory in equipment requiring industrial-temperature operation and synchronous parallel DRAM.
  • Embedded Memory Subsystems  Board-level SDRAM for embedded designs that need a 128 Mbit parallel SDRAM device with programmable burst and timing options.
  • Legacy or Board-Level Upgrades  Replacement or upgrade fits for designs using the 54‑pin TSOP II footprint and 3.3 V parallel SDRAM interfaces.
  • Networking and Communications Modules  Packet buffering and high-speed data buffering where 166 MHz synchronous access and burst operation improve throughput.

Unique Advantages

  • High-speed synchronous access: 166 MHz operation and 5.4 ns access time (CAS‑latency = 3) support fast read/write cycles.
  • Flexible transfer modes: Programmable burst lengths and sequence options let designers optimize throughput and latency for target workloads.
  • Adaptable timing: Selectable CAS latency (2 or 3) and random column addressing every clock allow matching to system timing requirements.
  • Industrial temperature range: −40 °C to 85 °C rating enables use in temperature-sensitive deployments.
  • Compact, standard package: 54‑pin TSOP II package simplifies integration into existing board layouts and replacements.
  • Power-management features: Auto-refresh, self-refresh and power-down modes help manage power in battery-assisted or power-sensitive systems.

Why Choose IS42S81600E-6TLI-TR?

The IS42S81600E-6TLI-TR provides a synchronous, pipelined 128 Mbit DRAM solution with configurable burst and timing options, making it suitable for designs that require predictable, high-speed parallel memory at a 3.3 V nominal supply. Its 54‑pin TSOP II package and industrial temperature rating offer straightforward board-level integration and environmental robustness.

This device is a practical choice for engineers building or maintaining embedded systems, industrial controllers, communications modules, or legacy platform upgrades where a 16M × 8 synchronous DRAM with 166 MHz capability, selectable CAS latency, and comprehensive refresh/power modes are required. Supporting documentation and datasheet details provide the timing and operational parameters needed for reliable system integration.

Request a quote or submit a product inquiry to receive pricing and availability information for the IS42S81600E-6TLI-TR.

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