IS42S81600E-6TLI-TR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 656 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S81600E-6TLI-TR – IC DRAM 128MBIT PAR 54TSOP II
The IS42S81600E-6TLI-TR is a 128 Mbit synchronous DRAM organized as 16M × 8 with a parallel interface and a 54-pin TSOP II package. It uses a pipelined, fully synchronous architecture with internal banking to support high-speed data transfer referenced to the rising clock edge.
Designed for systems that require a 128 Mbit SDRAM operating at 3.3 V nominal (3.0–3.6 V supply range) and industrial temperature capability (−40 °C to 85 °C), the device supports programmable burst modes, CAS latency options, and multiple refresh and power-management modes to fit a range of board-level memory subsystems.
Key Features
- Core & Architecture 128 Mbit SDRAM configured as 16M × 8 with quad-bank organization and pipeline architecture; all signals registered on the rising edge of CLK.
- Performance Supports a 166 MHz clock frequency (‑6 speed grade) with 5.4 ns access time (CAS‑latency = 3) for high-speed synchronous operation.
- Programmable Burst and Timing Programmable burst lengths (1, 2, 4, 8, full page), sequential or interleave burst sequences, and selectable CAS latency (2 or 3 clocks) for flexible data-transfer tuning.
- Refresh & Power Management Auto Refresh (CBR), Self Refresh and power-down modes supported; 4096 refresh cycles every 64 ms as specified for data retention.
- Interface & Logic Levels Parallel memory interface with LVTTL signalling for command and control paths.
- Voltage & Supply Nominal 3.3 V operation with a supply range of 3.0 V to 3.6 V; VDD and VDDQ designed for 3.3 V systems.
- Package & Temperature 54-pin TSOP II package (0.400", 10.16 mm width) and industrial operating temperature range of −40 °C to 85 °C for extended environmental tolerance.
Typical Applications
- Industrial Control Systems Memory buffering and system memory in equipment requiring industrial-temperature operation and synchronous parallel DRAM.
- Embedded Memory Subsystems Board-level SDRAM for embedded designs that need a 128 Mbit parallel SDRAM device with programmable burst and timing options.
- Legacy or Board-Level Upgrades Replacement or upgrade fits for designs using the 54‑pin TSOP II footprint and 3.3 V parallel SDRAM interfaces.
- Networking and Communications Modules Packet buffering and high-speed data buffering where 166 MHz synchronous access and burst operation improve throughput.
Unique Advantages
- High-speed synchronous access: 166 MHz operation and 5.4 ns access time (CAS‑latency = 3) support fast read/write cycles.
- Flexible transfer modes: Programmable burst lengths and sequence options let designers optimize throughput and latency for target workloads.
- Adaptable timing: Selectable CAS latency (2 or 3) and random column addressing every clock allow matching to system timing requirements.
- Industrial temperature range: −40 °C to 85 °C rating enables use in temperature-sensitive deployments.
- Compact, standard package: 54‑pin TSOP II package simplifies integration into existing board layouts and replacements.
- Power-management features: Auto-refresh, self-refresh and power-down modes help manage power in battery-assisted or power-sensitive systems.
Why Choose IS42S81600E-6TLI-TR?
The IS42S81600E-6TLI-TR provides a synchronous, pipelined 128 Mbit DRAM solution with configurable burst and timing options, making it suitable for designs that require predictable, high-speed parallel memory at a 3.3 V nominal supply. Its 54‑pin TSOP II package and industrial temperature rating offer straightforward board-level integration and environmental robustness.
This device is a practical choice for engineers building or maintaining embedded systems, industrial controllers, communications modules, or legacy platform upgrades where a 16M × 8 synchronous DRAM with 166 MHz capability, selectable CAS latency, and comprehensive refresh/power modes are required. Supporting documentation and datasheet details provide the timing and operational parameters needed for reliable system integration.
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