IS42S81600E-7TLI

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 881 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600E-7TLI – IC DRAM 128Mbit Parallel SDRAM, 54-TSOP II

The IS42S81600E-7TLI is a 128Mbit synchronous DRAM organized as 16M × 8 with a quad-bank, pipelined architecture for high-speed, clocked memory operations. It is designed for synchronous, parallel memory subsystems requiring programmable burst modes, internal bank management, and standard LVTTL signaling.

This device targets applications and systems that require a compact 54-pin TSOP II package, operation across an industrial temperature range (-40°C to 85°C), and a nominal 3.3V VDD memory environment with a supply range of 3.0V to 3.6V. The -7 speed grade supports a 143 MHz clock with CAS latency options for low access-time operation.

Key Features

  • Memory Core  128 Mbit SDRAM organized as 16M × 8 with internal quad-bank architecture enabling hidden row access and precharge for efficient pipelined operation.
  • Performance  -7 speed grade supports a 143 MHz clock frequency and CAS latency options (2 or 3 clocks); access times from clock as low as 5.4 ns for CAS = 3 in this grade.
  • Burst and Access Modes  Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequences (sequential or interleave) with burst read/write and burst read/single write capabilities; burst termination via stop or precharge commands.
  • Refresh and Power Management  Auto Refresh and Self Refresh support with 4096 refresh cycles every 64 ms; includes a power-down mode for reduced power consumption during idle periods.
  • Interface  Fully synchronous LVTTL interface with all signals referenced to the rising edge of CLK; random column addressing every clock cycle for high throughput.
  • Voltage and Supply  Designed for 3.3V VDD (operating supply range 3.0V–3.6V) with matched VDDQ, suitable for standard 3.3V memory systems.
  • Package and Mounting  Supplied in a 54-pin TSOP II package (0.400" / 10.16 mm width) for compact PCB footprint and surface-mount assembly.
  • Temperature Range  Industrial temperature availability with operating range from -40°C to 85°C (TA).

Typical Applications

  • Industrial Memory Subsystems  Use where -40°C to 85°C operation and predictable refresh behavior are required for system stability.
  • High‑Speed Buffering  Suitable for designs needing synchronous, pipelined DRAM buffering with 143 MHz clock capability and low CAS latency.
  • Compact PCB Designs  54-TSOP II package fits space-constrained boards that require a parallel DRAM interface and standard 3.3V supply.

Unique Advantages

  • Deterministic Synchronous Operation: All inputs and outputs are registered to the positive clock edge, enabling timing predictability in synchronous memory systems.
  • Flexible Burst Control: Multiple programmable burst lengths and sequences allow designers to optimize throughput and latency for varied access patterns.
  • Low Access-Time Performance: -7 grade provides a 143 MHz clock with access times from clock as low as 5.4 ns (CAS = 3), supporting time-critical read operations.
  • Industrial Temperature Support: Rated for -40°C to 85°C, making the device suitable for harsher operating environments where temperature resilience is required.
  • Compact, Surface‑Mount Package: 54-pin TSOP II (10.16 mm width) reduces board area while retaining a parallel DRAM interface for legacy and contemporary designs.
  • Standard 3.3V Memory System Compatibility: Designed for 3.3V VDD systems with a 3.0–3.6V supply range, simplifying integration into existing 3.3V memory architectures.

Why Choose IS42S81600E-7TLI?

The IS42S81600E-7TLI combines a compact 54-TSOP II footprint with a 128Mbit, quad-bank synchronous DRAM architecture to deliver predictable, high-speed memory performance for systems that require programmable burst modes, internal bank management, and LVTTL signaling. Its -7 speed grade, 143 MHz operation, and low access times make it suitable for designs with tight timing requirements.

This device is intended for designers and procurement teams seeking a reliable, industrial-temperature-capable SDRAM that integrates into 3.3V memory subsystems while offering flexible refresh and power-management features such as Auto Refresh, Self Refresh, and power-down modes for energy-conscious designs.

Request a quote or submit an inquiry to receive pricing and availability information for IS42S81600E-7TLI and to discuss how this 128 Mbit SDRAM can be integrated into your memory subsystem designs.

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