IS42S81600F-6TL-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,081 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600F-6TL-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S81600F-6TL-TR is a 128 Mbit volatile SDRAM device manufactured by ISSI (Integrated Silicon Solution Inc). It is organized as 16M x 8 with a parallel memory interface and is offered in a compact 54‑TSOP II package.

This device targets designs that require parallel SDRAM memory with a 166 MHz clock capability and a specified access time of 5.4 ns. It operates from a 3.0 V to 3.6 V supply and within a commercial temperature range of 0°C to 70°C.

Key Features

  • Memory Architecture 128 Mbit density organized as 16M x 8, providing byte-wide data access through a parallel interface.
  • Technology SDRAM (volatile memory) suitable for systems requiring dynamic read/write storage.
  • Performance Supports a 166 MHz clock frequency with an access time of 5.4 ns as specified.
  • Power Operates from a 3.0 V to 3.6 V supply range.
  • Package Supplied in a 54‑TSOP II (0.400", 10.16 mm width) package for compact board-level integration.
  • Operating Range Commercial ambient temperature rating of 0°C to 70°C (TA).
  • Mounting Type Device is provided for standard surface mounting (specified as volatile mounting type in product data).

Typical Applications

  • System DRAM — Provides 128 Mbit parallel SDRAM (16M x 8) for designs requiring conventional dynamic memory storage.
  • Parallel Memory Interfaces — Suited for boards and modules that use parallel SDRAM signaling at up to 166 MHz.
  • Compact Board Integration — 54‑TSOP II package supports higher density layouts where a commercial temperature range is acceptable.

Unique Advantages

  • 128 Mbit Capacity: Delivers a sizable memory footprint with a 16M x 8 organization for byte-wide access.
  • Defined Performance: 166 MHz clocking and 5.4 ns access time provide clear, measurable timing characteristics for system design.
  • Standard Supply Range: Operates on 3.0 V to 3.6 V, matching common 3.3 V system rails.
  • Compact Packaging: 54‑TSOP II (10.16 mm width) reduces board area while maintaining a parallel SDRAM interface.
  • Commercial Temperature Rating: Rated for 0°C to 70°C operation for designs within commercial environments.
  • Manufacturer — Produced by ISSI (Integrated Silicon Solution Inc), a known supplier of memory components.

Why Choose IC DRAM 128MBIT PAR 54TSOP II?

The IS42S81600F-6TL-TR is positioned for designs that require a 128 Mbit SDRAM device with parallel interface timing clearly defined by a 166 MHz clock and 5.4 ns access time. Its 16M x 8 organization, standard 3.0–3.6 V supply range, and compact 54‑TSOP II package make it suitable for board-level memory implementations within commercial temperature environments.

Engineers and procurement teams seeking a straightforward, manufacturer-specified SDRAM component from ISSI can leverage this device where the stated electrical, timing, and package characteristics meet design requirements.

Request a quote or submit a product inquiry to evaluate IS42S81600F-6TL-TR for your design and quoting needs.

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