IS42S81600F-6TLI-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,123 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600F-6TLI-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S81600F-6TLI-TR is a 128‑Mbit volatile SDRAM device from ISSI, organized as 16M × 8 with a parallel memory interface. It provides SDRAM performance with a clock frequency rating of 166 MHz and a 5.4 ns access time for board‑level memory applications.

Packaged in a 54‑TSOP II (0.400", 10.16 mm width) form factor and specified for operation from -40°C to 85°C with a supply voltage range of 3.0 V to 3.6 V, this device targets designs that require compact parallel DRAM with defined speed, voltage, and temperature characteristics.

Key Features

  • Memory Architecture 128 Mbit capacity organized as 16M × 8 in DRAM format, providing a parallel byte‑wide memory arrangement.
  • SDRAM Performance Supports a clock frequency of 166 MHz with an access time of 5.4 ns for predictable read/write timing.
  • Voltage Operates from 3.0 V to 3.6 V, matching common 3 V SDRAM power domains.
  • Package & Mounting 54‑TSOP II package (0.400", 10.16 mm width) suitable for board‑level mounting where compact parallel DRAM is required.
  • Operating Range Specified for ambient operation from -40°C to 85°C (TA), supporting extended temperature applications.
  • Interface Parallel memory interface compatible with standard SDRAM system designs.

Typical Applications

  • Parallel memory boards — Use as on‑board SDRAM in systems that require a 16M × 8 parallel memory device.
  • Embedded systems — Suitable where a 128 Mbit volatile SDRAM with defined speed and voltage is needed on the PCB.
  • Industrial electronics — Applicable to equipment operating across -40°C to 85°C that require parallel DRAM capacity in a compact TSOP package.

Unique Advantages

  • Well‑defined SDRAM timing: 166 MHz clock rating and 5.4 ns access time enable predictable performance for timing‑sensitive designs.
  • Compact TSOP II footprint: 54‑lead TSOP (0.400", 10.16 mm width) reduces board area compared with larger packages while retaining parallel interface connectivity.
  • Wide supply tolerance: 3.0 V to 3.6 V operating range provides flexibility for 3 V power domains.
  • Industrial temperature support: Rated for -40°C to 85°C (TA) to meet extended ambient requirements.
  • Byte‑wide organization: 16M × 8 arrangement simplifies integration into designs expecting an 8‑bit parallel DRAM data bus.

Why Choose IS42S81600F-6TLI-TR?

The IS42S81600F-6TLI-TR combines a 128‑Mbit SDRAM architecture with defined timing, voltage, and temperature specifications for reliable integration into parallel‑interface systems. Its 16M × 8 organization and 54‑TSOP II package make it suitable for board designs that require a compact, byte‑wide volatile memory solution.

Designed and manufactured by ISSI (Integrated Silicon Solution Inc), this device is appropriate for engineers and procurement teams seeking a documented SDRAM part with specified clock, access time, supply, and operating temperature characteristics.

Request a quote or contact sales for pricing and availability for the IS42S81600F-6TLI-TR. Provide part number and required quantities to receive a formal quotation.

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