IS42S81600F-6TLI

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 490 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S81600F-6TLI – 128 Mbit Parallel SDRAM, 54‑TSOP II

The IS42S81600F-6TLI is a 128 Mbit volatile DRAM implemented as synchronous DRAM (SDRAM) with a 16M × 8 memory organization and a parallel memory interface. It delivers a clock frequency of 166 MHz and a specified access time of 5.4 ns, packaged in a 54‑lead TSOP II (10.16 mm width).

This device is provided by ISSI (Integrated Silicon Solution Inc.) and is intended for use where a compact parallel SDRAM solution with defined supply and temperature ranges is required.

Key Features

  • Core / Memory Architecture Synchronous DRAM (SDRAM) organized as 16M × 8 for a total memory size of 128 Mbit.
  • Performance Clock frequency rated at 166 MHz with an access time of 5.4 ns to support synchronous memory operations.
  • Interface Parallel memory interface for direct integration with parallel bus memory systems.
  • Power Operating supply range of 3.0 V to 3.6 V, matching common 3.3 V system rails.
  • Package 54‑lead TSOP II (0.400", 10.16 mm width) supplier device package for space‑efficient board mounting.
  • Temperature Range Industrial operating temperature span from −40 °C to 85 °C (TA) for deployments in varying thermal environments.
  • Memory Type Volatile DRAM memory format intended for standard read/write volatile storage applications.

Typical Applications

  • Parallel SDRAM memory expansion — Integration where 128 Mbit of parallel SDRAM is required in a compact TSOP II package.
  • 3.3 V system memory — Designs utilizing 3.0–3.6 V supply rails that need synchronous DRAM with a parallel interface.
  • Temperature‑sensitive deployments — Systems operating across −40 °C to 85 °C that require maintained SDRAM performance.

Unique Advantages

  • 128 Mbit density in 16M × 8 organization: Provides a clearly defined memory capacity and organization for straightforward system mapping and address decoding.
  • Synchronous operation at 166 MHz: Enables timing‑controlled memory access consistent with SDRAM architectures and synchronous system designs.
  • Compact 54‑TSOP II package: Reduces PCB area while delivering a standard supplier device package form factor for surface mounting.
  • <strong-Wide supply tolerance: Supports a 3.0–3.6 V supply range to accommodate common 3.3 V designs and supply variance.
  • Industrial temperature rating: Rated for −40 °C to 85 °C, offering suitability for applications requiring extended ambient temperature operation.

Why Choose IS42S81600F-6TLI?

The IS42S81600F-6TLI combines a synchronous DRAM architecture with a 16M × 8 organization and 128 Mbit capacity, offering a deterministic parallel memory option with documented clock and access timing (166 MHz clock, 5.4 ns access time). Its 54‑lead TSOP II package and 3.0–3.6 V supply compatibility make it a compact choice for systems requiring standardized parallel SDRAM integration.

Manufactured by ISSI, this device is suitable for designs that need a defined balance of performance, packaging density, and an industrial operating temperature range, providing a clear specification set for procurement and system integration.

If you need pricing, lead time, or technical assistance for IS42S81600F-6TLI, request a quote or submit an inquiry to receive detailed availability and ordering information.

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