IS42S83200B-6TL-TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 77 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S83200B-6TL-TR - 256Mbit Synchronous DRAM
The IS42S83200B-6TL-TR is a high-performance 256-megabit Synchronous DRAM (SDRAM) from ISSI, Integrated Silicon Solution Inc. Organized as 32M x 8, this parallel-interface memory device operates at clock frequencies up to 166MHz with a fast 5.4ns access time. Designed for cost-sensitive embedded applications, it provides reliable volatile memory storage for systems requiring moderate density and proven SDRAM technology.
Key Features
- Memory Architecture - 256Mbit capacity organized as 32M x 8, providing flexible byte-wide data access for embedded processors and controllers.
- Performance Specifications - Operates at 166MHz clock frequency with 5.4ns access time, delivering responsive data throughput for real-time applications.
- Interface Type - Parallel SDRAM interface simplifies integration with legacy microprocessors and FPGAs that use traditional memory buses.
- Power Requirements - 3V to 3.6V supply voltage range supports standard 3.3V system designs and enables compatibility with common embedded platforms.
- Package Format - 54-pin TSOP II package (0.400" / 10.16mm width) offers high pin density in a compact surface-mount footprint for space-constrained boards.
- Operating Temperature - Commercial temperature range of 0°C to 70°C (TA) suits standard indoor and controlled-environment applications.
Typical Applications
- Embedded Computing Systems - This SDRAM serves as main memory for microcontroller and microprocessor-based designs where moderate memory capacity and parallel bus architecture align with existing system interfaces.
- Consumer Electronics - Provides working memory for set-top boxes, digital cameras, and multimedia devices that require cost-effective volatile storage for buffering and data processing tasks.
- Networking Equipment - Functions as packet buffer memory in routers, switches, and network appliances where the parallel interface integrates readily with control processors managing data flow.
- Test and Measurement Instruments - Offers temporary data storage for oscilloscopes, logic analyzers, and diagnostic equipment operating within commercial temperature ranges and requiring proven memory technology.
- Legacy System Upgrades - Enables memory expansion or replacement in existing designs built around parallel SDRAM architectures, maintaining compatibility with established circuit board layouts.
Unique Advantages
- Proven Technology Foundation: SDRAM architecture represents mature, well-understood memory technology that reduces design risk and simplifies validation for production systems.
- Straightforward Integration: Parallel interface eliminates the complexity of serial protocols, allowing designers to implement memory subsystems using conventional address and data bus methodologies.
- Flexible Data Organization: The 32M x 8 structure provides byte-wide access that matches common data path widths in embedded processors, reducing the need for additional bus width conversion logic.
- Compact Surface Mount Package: TSOP II package delivers space efficiency on PCBs while maintaining compatibility with standard SMT assembly processes and equipment.
- Standard Voltage Operation: The 3V to 3.6V supply range aligns with widespread 3.3V system designs, eliminating the need for dedicated voltage regulators or level shifters in most applications.
- Cost-Effective Capacity: 256Mbit density offers an economical balance for applications requiring more than basic memory but not demanding multi-gigabit capacities, optimizing bill-of-materials costs.
Why Choose IS42S83200B-6TL-TR?
The IS42S83200B-6TL-TR represents a practical memory solution for embedded designs that have established parallel SDRAM architectures or are maintaining compatibility with legacy system requirements. Its 256Mbit capacity and 166MHz operation provide sufficient performance for a wide range of consumer, industrial, and networking applications operating in commercial temperature environments. The TSOP II package and standard 3.3V operation simplify board design and procurement.
Note: This product has an Obsolete lifecycle status. Designers should verify availability for new projects and consider identifying alternative components for long-term production requirements.
Get Started with IS42S83200B-6TL-TR
Contact our sales team to discuss availability, pricing, and technical specifications for the IS42S83200B-6TL-TR. Our experts can help you evaluate whether this SDRAM meets your application requirements and assist with sourcing solutions for both new designs and ongoing production needs.