IS42S83200B-6TL-TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 77 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S83200B-6TL-TR - 256Mbit Synchronous DRAM

The IS42S83200B-6TL-TR is a high-performance 256-megabit Synchronous DRAM (SDRAM) from ISSI, Integrated Silicon Solution Inc. Organized as 32M x 8, this parallel-interface memory device operates at clock frequencies up to 166MHz with a fast 5.4ns access time. Designed for cost-sensitive embedded applications, it provides reliable volatile memory storage for systems requiring moderate density and proven SDRAM technology.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 32M x 8, providing flexible byte-wide data access for embedded processors and controllers.
  • Performance Specifications - Operates at 166MHz clock frequency with 5.4ns access time, delivering responsive data throughput for real-time applications.
  • Interface Type - Parallel SDRAM interface simplifies integration with legacy microprocessors and FPGAs that use traditional memory buses.
  • Power Requirements - 3V to 3.6V supply voltage range supports standard 3.3V system designs and enables compatibility with common embedded platforms.
  • Package Format - 54-pin TSOP II package (0.400" / 10.16mm width) offers high pin density in a compact surface-mount footprint for space-constrained boards.
  • Operating Temperature - Commercial temperature range of 0°C to 70°C (TA) suits standard indoor and controlled-environment applications.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main memory for microcontroller and microprocessor-based designs where moderate memory capacity and parallel bus architecture align with existing system interfaces.
  • Consumer Electronics - Provides working memory for set-top boxes, digital cameras, and multimedia devices that require cost-effective volatile storage for buffering and data processing tasks.
  • Networking Equipment - Functions as packet buffer memory in routers, switches, and network appliances where the parallel interface integrates readily with control processors managing data flow.
  • Test and Measurement Instruments - Offers temporary data storage for oscilloscopes, logic analyzers, and diagnostic equipment operating within commercial temperature ranges and requiring proven memory technology.
  • Legacy System Upgrades - Enables memory expansion or replacement in existing designs built around parallel SDRAM architectures, maintaining compatibility with established circuit board layouts.

Unique Advantages

  • Proven Technology Foundation: SDRAM architecture represents mature, well-understood memory technology that reduces design risk and simplifies validation for production systems.
  • Straightforward Integration: Parallel interface eliminates the complexity of serial protocols, allowing designers to implement memory subsystems using conventional address and data bus methodologies.
  • Flexible Data Organization: The 32M x 8 structure provides byte-wide access that matches common data path widths in embedded processors, reducing the need for additional bus width conversion logic.
  • Compact Surface Mount Package: TSOP II package delivers space efficiency on PCBs while maintaining compatibility with standard SMT assembly processes and equipment.
  • Standard Voltage Operation: The 3V to 3.6V supply range aligns with widespread 3.3V system designs, eliminating the need for dedicated voltage regulators or level shifters in most applications.
  • Cost-Effective Capacity: 256Mbit density offers an economical balance for applications requiring more than basic memory but not demanding multi-gigabit capacities, optimizing bill-of-materials costs.

Why Choose IS42S83200B-6TL-TR?

The IS42S83200B-6TL-TR represents a practical memory solution for embedded designs that have established parallel SDRAM architectures or are maintaining compatibility with legacy system requirements. Its 256Mbit capacity and 166MHz operation provide sufficient performance for a wide range of consumer, industrial, and networking applications operating in commercial temperature environments. The TSOP II package and standard 3.3V operation simplify board design and procurement.

Note: This product has an Obsolete lifecycle status. Designers should verify availability for new projects and consider identifying alternative components for long-term production requirements.

Get Started with IS42S83200B-6TL-TR

Contact our sales team to discuss availability, pricing, and technical specifications for the IS42S83200B-6TL-TR. Our experts can help you evaluate whether this SDRAM meets your application requirements and assist with sourcing solutions for both new designs and ongoing production needs.

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