IS43DR16320E-25DBLI

IC DRAM 512MBIT PAR 84TWBGA
Part Description

IC DRAM 512MBIT PAR 84TWBGA

Quantity 103 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package84-TWBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeIndustrial
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43DR16320E-25DBLI – IC DRAM 512Mbit PAR 84TWBGA

The IS43DR16320E-25DBLI is a 512 Mbit DDR2 SDRAM organized as 32M × 16 with a parallel memory interface. It provides DDR2-class operation with a 400 MHz clock frequency and is supplied in an 84-TWBGA package.

Designed for designs that require volatile, high-speed parallel DRAM, this device offers operation across a -40°C to 85°C ambient range and supports a supply voltage range of 1.7 V to 1.9 V.

Key Features

  • Memory Type & Organization DDR2 SDRAM, organized as 32M × 16 for a total density of 512 Mbit.
  • Performance 400 MHz clock frequency with an access time of 400 ps and a write cycle time (word page) of 15 ns.
  • Power Nominal supply voltage range of 1.7 V to 1.9 V compatible with DDR2 voltage levels.
  • Package 84-TWBGA (8 × 12.5 mm) BGA package for compact board-level integration.
  • Interface Parallel memory interface suitable for DDR2 SDRAM architectures.
  • Operating Temperature Specified ambient range of -40°C to 85°C (TA).

Unique Advantages

  • DDR2 performance: Leverages a 400 MHz clock and 400 ps access time to meet high-throughput DRAM requirements where DDR2 timing is specified.
  • Compact BGA footprint: 84-TWBGA packaging (8 × 12.5 mm) reduces board area for dense memory layouts.
  • Wide ambient temperature range: Rated from -40°C to 85°C to support applications requiring a broad operating temperature window.
  • Low-voltage operation: 1.7 V–1.9 V supply accommodates systems designed around DDR2 voltage rails.
  • Standard memory organization: 32M × 16 organization simplifies integration into designs expecting parallel 16-bit DDR2 devices.

Why Choose IS43DR16320E-25DBLI?

The IS43DR16320E-25DBLI provides a straightforward DDR2 SDRAM solution with clearly specified electrical and timing characteristics—32M × 16 organization, 400 MHz clock, 400 ps access time, and 1.7 V–1.9 V operation—packaged in a compact 84-TWBGA. It is positioned for designs that require a 512 Mbit parallel DDR2 memory device with defined performance and temperature range.

Choose this device when your design requires a documented DDR2 memory component with a compact BGA package and industry-standard organization for integration into systems operating across -40°C to 85°C ambient conditions.

Request a quote or submit an inquiry for pricing and availability for the IS43DR16320E-25DBLI.

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