IS43R16320E-6TL

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 517 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceSSTL_2Memory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS43R16320E-6TL – IC DRAM 512Mbit PAR 66TSOP II

The IS43R16320E-6TL is a 512 Mbit volatile DRAM device implemented as DDR SDRAM with a 32M × 16 memory organization. It provides a 166 MHz clock interface and SSTL_2 signaling for designs that require synchronous, high-speed parallel memory.

With a compact 66-TSSOP / 66-TSOP II package and a 2.3 V to 2.7 V supply range, this device targets systems where board space and predictable DDR timing are important, while operating across a 0 °C to 70 °C ambient range.

Key Features

  • Memory Type & Architecture  512 Mbit DDR SDRAM organized as 32M × 16, providing synchronous DRAM storage in a parallel memory format.
  • Performance  Designed for a 166 MHz clock frequency with an access time of 700 ps and a write cycle time (word/page) of 15 ns to meet synchronous data transfer timing requirements.
  • Interface  SSTL_2 memory interface signaling for DDR operation, supporting synchronized system-level memory transactions.
  • Power  Operates from a 2.3 V to 2.7 V supply range, enabling use in systems with low-voltage DDR power rails.
  • Package  Available in a 66-TSSOP (0.400", 10.16 mm width) / 66-TSOP II package for compact board-level integration.
  • Operating Range  Specified for ambient operation from 0 °C to 70 °C (TA), suitable for standard commercial-temperature applications.

Typical Applications

  • Embedded memory subsystems  Use as on-board DDR SDRAM for embedded controllers and modules that require 512 Mbit volatile storage.
  • Consumer electronics  Integration in compact devices that need synchronous parallel memory with a small-package footprint.
  • Communication equipment  Deployment in systems that rely on SSTL_2 DDR signaling and predictable access/write timing for data buffering.

Unique Advantages

  • DDR SDRAM organization (32M × 16): Provides a balanced word-width and density for 16-bit parallel data paths.
  • Synchronized 166 MHz clock: Enables consistent timing behavior for systems designed around this DDR frequency.
  • Compact 66-TSOP II package: Reduces board area while maintaining pinout density for parallel memory connections.
  • Low-voltage operation: 2.3 V to 2.7 V supply range supports designs targeting low-voltage DDR rails.
  • Deterministic timing specs: 700 ps access time and 15 ns write cycle time (word/page) allow precise system timing analysis.

Why Choose IS43R16320E-6TL?

The IS43R16320E-6TL delivers DDR SDRAM performance in a 512 Mbit density with a 32M × 16 organization, packaged in a compact 66-TSOP II footprint. Its specified 166 MHz clock, SSTL_2 interface, and defined timing parameters make it suitable for designs that require predictable synchronous memory behavior and a low-voltage supply.

This device is appropriate for engineers designing commercial-temperature embedded systems, consumer products, or communication equipment requiring parallel DDR memory integration, offering clear electrical and mechanical specifications to support system-level planning and validation.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the IS43R16320E-6TL.

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