IS43R16320F-5BL-TR

IC DRAM 512MBIT PAR 60TFBGA
Part Description

IC DRAM 512MBIT PAR 60TFBGA

Quantity 1,429 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R16320F-5BL-TR - 512Mbit DDR SDRAM in Compact TFBGA Package

The IS43R16320F-5BL-TR is a 512Mbit DDR SDRAM from ISSI, Integrated Silicon Solution Inc, offering reliable synchronous dynamic memory in a space-efficient 60-pin TFBGA package. Organized as 32M x 16, this DDR memory operates at 200MHz clock frequency and delivers fast 0.7ns access time, making it ideal for embedded systems, consumer electronics, and industrial applications requiring moderate memory capacity with compact board footprint.

With a standard operating temperature range of 0°C to 70°C and a voltage supply of 2.3V to 2.7V, this DRAM provides a balance of performance and power efficiency for cost-sensitive designs where commercial-grade temperature tolerance is sufficient.

Key Features

  • Memory Architecture - 512Mbit (64MB) capacity organized as 32M x 16, providing parallel data access suitable for applications requiring word-oriented memory operations.
  • DDR SDRAM Technology - Double Data Rate synchronous operation at 200MHz clock frequency enables data transfer on both rising and falling clock edges, effectively doubling throughput compared to conventional SDRAM.
  • Fast Access Performance - 0.7ns access time and 15ns write cycle time support responsive system performance in real-time applications and data-intensive processing tasks.
  • Compact TFBGA Package - 60-pin TFBGA (8mm x 13mm) surface-mount package minimizes PCB footprint, enabling higher component density in space-constrained embedded designs.
  • Standard Voltage Operation - 2.3V to 2.7V supply voltage aligns with common embedded system power rails, simplifying power distribution design and reducing component count.
  • Commercial Temperature Grade - 0°C to 70°C operating range suits office, home, and controlled industrial environments where extended temperature tolerance is not required.

Typical Applications

  • Consumer Electronics - This DDR SDRAM serves as system memory in set-top boxes, digital televisions, and multimedia devices where the compact TFBGA package helps achieve slim product profiles while providing sufficient bandwidth for audio/video processing.
  • Embedded Computing Systems - The parallel interface and moderate capacity make this memory suitable for ARM-based or microprocessor systems requiring external RAM for OS and application execution, with the 200MHz operation supporting real-time task switching.
  • Networking Equipment - Commercial-grade routers, switches, and access points leverage this DRAM for packet buffering and routing table storage, where the 512Mbit capacity handles typical data throughput requirements without over-provisioning.
  • Industrial Control Panels - HMI terminals and operator panels operating in climate-controlled factory settings use this memory for GUI frameworks and data logging, benefiting from the TFBGA package's resistance to vibration in panel-mounted installations.
  • Office Automation Equipment - Printers, scanners, and multifunction devices utilize this DRAM for image buffering and document processing, where the parallel interface enables fast data transfers between imaging sensors and processing units.

Unique Advantages

  • Optimized Footprint-to-Capacity Ratio: The 60-pin TFBGA package delivers 512Mbit in just 104mm², enabling higher memory density per board area compared to larger package options.
  • Simplified PCB Layout: Parallel interface eliminates the need for SerDes circuitry or complex routing required by serial memory technologies, reducing design complexity and layer count.
  • Cost-Effective Memory Solution: Commercial temperature grade and standard voltage operation avoid premium pricing associated with extended-temperature or low-power variants, reducing BOM costs in suitable applications.
  • Proven DDR Technology: Mature SDRAM architecture is supported by established controller IP and driver software across multiple processor families, accelerating time-to-market.
  • Reliable Performance in Controlled Environments: Active lifecycle status and ISSI's established manufacturing ensure component availability for products deployed in office, retail, and controlled industrial settings.
  • Balanced Speed and Power: 200MHz operation provides sufficient bandwidth for common embedded tasks while avoiding the higher power consumption associated with faster DDR2 or DDR3 variants.

Why Choose IS43R16320F-5BL-TR?

The IS43R16320F-5BL-TR is positioned for embedded system designers seeking a compact, cost-effective DDR SDRAM solution for commercial-grade applications. Its combination of 512Mbit capacity, parallel interface, and space-saving TFBGA package makes it particularly well-suited for consumer electronics, office equipment, and industrial HMI designs where board space is at a premium and operating environments remain within 0°C to 70°C.

For engineering teams developing products with moderate memory requirements, this DRAM offers straightforward integration with established parallel memory controllers, reducing both component costs and development time compared to migrating to serial or higher-speed memory technologies. The Active lifecycle status ensures reliable supply for current production planning.

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Contact our sales team to request pricing, availability, and technical support for the IS43R16320F-5BL-TR. Our engineers can assist with integration guidance, PCB layout recommendations, and volume pricing options to support your project requirements.

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