IS43R16320F-5BLI

IC DRAM 512MBIT PAR 60TFBGA
Part Description

IC DRAM 512MBIT PAR 60TFBGA

Quantity 973 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R16320F-5BLI - 512Mbit DDR SDRAM in Compact 60-TFBGA Package

The IS43R16320F-5BLI is a 512-megabit synchronous dynamic random-access memory (SDRAM) utilizing DDR (Double Data Rate) technology. Organized as 32M x 16, this memory device delivers 200 MHz clock frequency operation in a space-efficient 60-pin TFBGA package measuring just 8x13mm. Designed for embedded systems requiring reliable volatile memory with extended temperature tolerance, this DRAM supports applications from industrial automation to consumer electronics where compact form factor and proven DDR interface compatibility are essential.

Key Features

  • Memory Configuration - 512-megabit capacity organized as 32M x 16-bit words, providing flexible data path width for various system architectures.
  • DDR SDRAM Technology - Double Data Rate interface with 200 MHz clock frequency and 0.7ns access time enables high-bandwidth data transfers while maintaining broad controller compatibility.
  • Power Supply - Operates from 2.3V to 2.7V supply voltage, supporting low-power system designs and compatibility with standard 2.5V logic levels.
  • Extended Temperature Range - Rated for -40°C to 85°C ambient temperature operation, suitable for industrial and automotive-adjacent applications requiring environmental resilience.
  • Compact Package - 60-pin TFBGA measuring 8x13mm minimizes PCB footprint, critical for space-constrained embedded designs.
  • Parallel Interface - Standard parallel memory bus enables straightforward integration with processors, FPGAs, and dedicated memory controllers.

Typical Applications

  • Industrial Control Systems - This DDR SDRAM provides working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs where the extended temperature range ensures reliable operation in factory floor environments and the compact package fits space-limited control panels.
  • Consumer Electronics - The 512Mbit capacity and 200 MHz operation support set-top boxes, digital media players, and smart home devices where cost-effective volatile memory with moderate bandwidth meets buffering and processing requirements.
  • Networking Equipment - Routers, switches, and access points utilize this DRAM for packet buffering and routing tables, benefiting from the parallel interface's predictable latency and the device's industrial temperature tolerance for telecom closet installations.
  • Medical Instrumentation - Diagnostic equipment and patient monitoring systems leverage this memory for real-time data processing and display buffering, where the compact TFBGA package enables portable device designs and the extended temperature rating supports varied clinical environments.
  • Point-of-Sale Terminals - Payment terminals and retail checkout systems use this SDRAM for transaction processing and user interface operations, where the combination of moderate capacity, proven DDR interface, and wide temperature tolerance addresses commercial deployment requirements.

Unique Advantages

  • Proven DDR Interface Compatibility: Broad ecosystem of compatible controllers and processors reduces development risk and accelerates time-to-market for new designs.
  • Extended Temperature Qualification: -40°C to 85°C operation eliminates the need for thermal management in many industrial and outdoor installations, simplifying system design.
  • Compact 8x13mm Footprint: TFBGA package saves valuable PCB real estate compared to larger TSOP or BGA alternatives, enabling smaller end products or additional feature integration.
  • Standard 2.5V Logic Compatibility: 2.3V to 2.7V supply voltage range integrates seamlessly with common processor I/O banks and system power rails, reducing power conversion complexity.
  • 15ns Write Cycle Time: Fast write cycles support demanding real-time applications including video buffering and network packet handling.
  • Active Lifecycle Status: Current production availability ensures long-term supply security for products with multi-year lifecycle requirements.

Why Choose IS43R16320F-5BLI?

This DDR SDRAM delivers the reliable volatile memory performance required for embedded systems where proven technology, compact packaging, and environmental resilience matter more than cutting-edge specifications. The 32M x 16 organization provides an optimal balance between capacity and data path width for controllers ranging from 16-bit microcontrollers to 32-bit embedded processors, while the standard DDR interface ensures compatibility with established design practices and widely available controller IP.

For engineers developing industrial controls, medical devices, or commercial equipment with 5-10 year product lifecycles, the IS43R16320F-5BLI's active production status and mature technology base reduce supply chain risk. The extended temperature rating and compact TFBGA package address real-world deployment constraints without premium pricing, making this device well-suited for cost-sensitive designs requiring industrial-grade reliability.

Get a Quote

Contact our sales team to discuss your memory requirements, obtain pricing for your volume, or request samples for evaluation. Our technical support staff can assist with integration guidance and answer questions about compatibility with your specific controller or system architecture.

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