IS45S16160L-7TLA1

The IS45S16160L-7TLA1 is a 256 Mbit volatile DRAM implemented as SDRAM with a 16M × 16 memory organization. Manufactured by ISSI (Integrated Silicon Solution Inc), it provides an LVTTL memory interface and is optimized for systems requiring external SDRAM at a 3.0 V–3.6 V supply.

This device targets applications that need a mid-density SDRAM solution with defined clock and access performance, compact 54‑TSOP II packaging, and an extended operating temperature range of −40°C to 85°C.

Key Features

• Memory Type & Architecture 256 Mbit SDRAM (DRAM) implemented as 16M × 16 organization for byte-parallel data access.
• Performance Supports a clock frequency of 143 MHz with an access time of 5.4 ns, enabling rapid read/write cycles consistent with the specified timing.
• Interface LVTTL memory interface for standard logic-level signaling and external memory integration.
• Power Operates from a 3.0 V–3.6 V supply range, accommodating common 3.3 V system rails.
• Package & Mounting Supplied in a 54‑TSOP II surface-mount package (0.400" / 10.16 mm width) for compact PCB layouts.
• Operating Temperature Rated for −40°C to 85°C (TA), suitable for designs requiring extended temperature range operation.

Typical Applications

• Embedded memory for system designs Provides 256 Mbit SDRAM capacity with LVTTL signaling and 3.0 V–3.6 V operation for external memory expansion in embedded systems.
• Temporary data buffering 143 MHz clocking and 5.4 ns access time support use as a buffer or working memory for data-intensive tasks.
• Space-constrained PCBs The 54‑TSOP II package (10.16 mm width) enables integration where board area and profile are limited.

Unique Advantages

• High-density 256 Mbit capacity: Delivers substantial memory capacity in a single 54‑TSOP II device to minimize component count.
• Defined timing performance: 143 MHz clock and 5.4 ns access time give clear performance parameters for system timing and memory scheduling.
• Standard LVTTL interface: Simplifies integration with common digital logic levels and external memory controllers.
• 3.0 V–3.6 V supply compatibility: Matches typical 3.3 V system rails for straightforward power design.
• Extended operating temperature: −40°C to 85°C rating supports deployments across a wide ambient range.
• Compact TSOP packaging: 54‑TSOP II reduces board footprint while maintaining accessible pinout for SMT assembly.

Why Choose IC DRAM 256MBIT PAR 54TSOP II?

The IS45S16160L-7TLA1 positions itself as a practical SDRAM option where a 256 Mbit density, predictable timing (143 MHz clock, 5.4 ns access), and a compact 54‑TSOP II package are required. Its LVTTL interface and 3.0 V–3.6 V supply range make it straightforward to integrate into standard digital systems.

This device is well-suited to designers seeking a mid-density external SDRAM solution that balances capacity, measured performance, and a small-package form factor within an extended operating temperature window.

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