IS45S16320F-7BLA1
| Part Description |
IC DRAM 512MBIT PAR 54TFBGA |
|---|---|
| Quantity | 870 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TW-BGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS45S16320F-7BLA1 – IC DRAM 512MBIT PAR 54TFBGA
The IS45S16320F-7BLA1 from Integrated Silicon Solution Inc. (ISSI) is a 512 Mbit volatile SDRAM device organized as 32M × 16 with a parallel memory interface. It delivers specified timing and power-operating ranges for system designs that require on-board DRAM in a compact ball grid array package.
This SDRAM is specified with a 143 MHz clock frequency, a 5.4 ns access time, and a supply range of 3.0 V to 3.6 V, enabling use where these electrical and timing characteristics match system requirements.
Key Features
- Memory 512 Mbit capacity organized as 32M × 16 providing a wide parallel data path for high-density memory needs.
- Technology & Type SDRAM volatile memory in DRAM format designed for systems requiring synchronous parallel DRAM operation.
- Performance Specified clock frequency of 143 MHz and an access time of 5.4 ns for timing-sensitive applications.
- Power Operates from a 3.0 V to 3.6 V supply range to match common 3V-class system rails.
- Package & Mounting Supplied in a 54-ball thin fine-pitch BGA (54-TFBGA). Supplier package reference: 54-TW-BGA (8×13), suitable for surface-mount PCB assembly.
- Environmental Range Device operating temperature is specified from −40°C to 85°C (TA), supporting a wide commercial and industrial ambient range.
- Interface Parallel memory interface for direct integration where parallel SDRAM is required.
Typical Applications
- Board-Level Memory Expansion Provides 512 Mbit of parallel SDRAM density for systems that require additional DRAM capacity in a compact BGA footprint.
- System Memory Modules Can be used as on-board DRAM in designs that operate at 3.0–3.6 V and require the defined timing characteristics.
- High-Speed Buffering Suitable for buffering tasks where a 143 MHz clock and 5.4 ns access time meet system performance requirements.
Unique Advantages
- High-density footprint: 512 Mbit capacity in a 32M × 16 organization provides substantial memory in a single device, reducing board-level part count.
- Compact BGA package: 54-TFBGA (54-TW-BGA, 8×13) packaging enables space-efficient surface-mount designs.
- Wide operating temperature: Rated for −40°C to 85°C (TA), supporting designs across common commercial and industrial ambient conditions.
- Standard 3V supply compatibility: 3.0 V to 3.6 V supply range aligns with typical 3V system rails for straightforward power integration.
- Deterministic timing: 143 MHz clock frequency and 5.4 ns access time allow designers to plan memory timing and throughput precisely.
Why Choose IS45S16320F-7BLA1?
The IS45S16320F-7BLA1 positions itself as a high-density SDRAM option in a compact 54-ball TFBGA package, offering specific timing (143 MHz clock, 5.4 ns access) and electrical (3.0–3.6 V) characteristics. Its 32M × 16 organization and parallel interface make it suitable for designs that require defined DRAM timing and a wide data bus.
This device is appropriate for engineers and procurement teams specifying discrete SDRAM where payload density, package size, and specified operating ranges (temperature and voltage) are primary selection criteria. The clear published specifications support integration, verification, and long-term BOM stability for board-level memory implementations.
Request a quote or contact sales to discuss availability, lead times, and pricing for the IS45S16320F-7BLA1.