IS45S16800F-7TLA2-TR

The IS45S16800F-7TLA2-TR is a 128 Mbit parallel SDRAM organized as 8M × 16, provided in a 54‑TSOP II (0.400", 10.16 mm width) package. It implements standard SDRAM architecture with a parallel memory interface for integration into designs that require external DRAM storage.

This device offers specified timing and power characteristics including a clock frequency of 143 MHz, an access time of 5.4 ns, and an operating voltage range of 3.0 V to 3.6 V, with an operating temperature range from −40 °C to 105 °C for deployments across varied thermal environments.

Key Features

• Memory Core 128 Mbit SDRAM organized as 8M × 16 providing parallel DRAM storage for external memory applications.
• Performance Supports a clock frequency up to 143 MHz with an access time of 5.4 ns for predictable read/write timing.
• Interface Parallel memory interface compatible with standard SDRAM system architectures requiring external DRAM.
• Power Operates from 3.0 V to 3.6 V, enabling use in systems designed around a 3 V supply domain.
• Package Supplied in a 54‑TSOP II (0.400", 10.16 mm width) package to support compact board layouts and automated assembly.
• Operating Range Specified for operation from −40 °C to 105 °C (TA), accommodating designs with extended temperature requirements.

Typical Applications

• Parallel-memory system designs — Used where an external parallel SDRAM is required for system memory expansion or buffering.
• Compact PCB implementations — The 54‑TSOP II package supports space-constrained board layouts that require surface-mount DRAM.
• Temperature-challenged environments — Suitable for designs that must operate across a wide ambient temperature range down to −40 °C and up to 105 °C.

Unique Advantages

• Deterministic timing — Defined clock frequency (143 MHz) and access time (5.4 ns) enable predictable memory performance for timing-sensitive designs.
• Standard organization — 8M × 16 memory organization simplifies system-level addressing and layout for parallel SDRAM interfaces.
• Wide supply tolerance — 3.0 V to 3.6 V supply range provides flexibility within 3 V system domains.
• Compact surface-mount package — 54‑TSOP II footprint supports high-density PCB designs and automated assembly processes.
• Extended temperature capability — Rated from −40 °C to 105 °C to support deployment in environments with broad thermal variation.

Why Choose IS45S16800F-7TLA2-TR?

The IS45S16800F-7TLA2-TR combines a proven SDRAM architecture with explicit timing, supply, and temperature specifications to support designs that require a parallel external memory solution. Its 8M × 16 organization, 143 MHz clock capability, and 5.4 ns access time provide clear, verifiable performance parameters for system integration.

This device is well suited for engineers specifying a compact, surface-mount 128 Mbit DRAM in applications where a defined voltage range and extended operating temperature are required. The clear specification set aids procurement and design decisions where predictable memory behavior and package footprint matter.

If you would like pricing, availability, or a formal quote for IS45S16800F-7TLA2-TR, please submit a request or contact sales to discuss your requirements and lead times.