IS45S16800F-7TLA2

The IS45S16800F-7TLA2 is a 128 Mbit volatile SDRAM device manufactured by ISSI (Integrated Silicon Solution Inc). It is organized as 8M × 16 with a parallel memory interface and is provided in a 54-TSOP II package.

Designed for systems that require parallel SDRAM storage with defined timing and voltage characteristics, this device offers a combination of mid-density memory capacity, a 143 MHz clock frequency, and an extended operating temperature range to meet a range of embedded and electronics applications.

Key Features

• Memory Architecture 128 Mbit SDRAM organized as 8M × 16 providing parallel DRAM storage suitable for designs requiring this organization.
• Performance Clock frequency specified at 143 MHz with an access time of 5.4 ns for defined timing performance.
• Power Supply voltage range of 3.0 V to 3.6 V to match common 3 V-class system rails.
• Package Available in a 54-TSOP II package (0.400", 10.16 mm width) for board-level integration where this package profile is required.
• Operating Temperature Specified operating range from -40°C to 105°C (TA) for extended temperature operation.
• Interface Parallel memory interface (DRAM format) compatible with parallel SDRAM implementations.
• Regulatory/Environmental RoHS status: Not specified in the provided product data.

Typical Applications

• Parallel memory subsystems — Acts as board-level SDRAM for systems implementing parallel DRAM interfaces where 8M × 16 organization is required.
• Embedded systems — Provides volatile working memory for processors or controllers that use a parallel SDRAM interface.
• Buffering and data storage — Serves as intermediate high-speed volatile storage for data buffering in devices that support a 3.0–3.6 V supply and TSOP II packaging.

Unique Advantages

• Mid-density 128 Mbit capacity: Delivers significant on-board SDRAM capacity in an 8M × 16 organization for systems requiring this density.
• Defined timing performance: 5.4 ns access time and 143 MHz clock frequency provide clear timing specifications for system design and validation.
• Wide temperature range: −40°C to 105°C operating range supports applications that require extended temperature operation.
• Standard TSOP II package: 54-TSOP (0.400", 10.16 mm width) package facilitates integration into PCBs designed for this footprint.
• 3.0–3.6 V supply compatibility: Matches common 3 V-class system rails for straightforward power domain integration.
• Manufacturer backing: Supplied by ISSI (Integrated Silicon Solution Inc), with technical specifications provided for engineering evaluation.

Why Choose IS45S16800F-7TLA2?

The IS45S16800F-7TLA2 positions itself as a reliable mid-density SDRAM option with clear electrical and timing specifications, a parallel interface, and a compact 54-TSOP II package. Its combination of 128 Mbit capacity, 5.4 ns access time, and 143 MHz clock frequency makes it suitable for designs that need defined SDRAM performance within a 3.0–3.6 V power envelope.

This device is well-suited to designers and procurement teams seeking a standardized parallel DRAM component with an extended operating temperature range and a commonly used TSOP II package for board-level memory implementations.

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