IS45S32200L-7TLA1-TR
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 293 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S32200L-7TLA1-TR – IC DRAM 64Mbit PAR 86TSOP II
The IS45S32200L-7TLA1-TR is a 64 Mbit volatile SDRAM device organized as 2M × 32 with a parallel memory interface. It delivers specified clock operation up to 143 MHz and a 5.4 ns access time for applications that require synchronous DRAM timing and predictable latency.
Manufactured by Integrated Silicon Solution Inc (ISSI), this device is available in an 86-TSOP II package and supports a 3.0 V to 3.6 V supply range and an extended ambient operating temperature from −40°C to 85°C.
Key Features
- Memory Architecture 64 Mbit capacity organized as 2M × 32, providing a wide 32-bit data path for parallel memory implementations.
- SDRAM Technology Synchronous DRAM core operating with a parallel interface for timing-determined access and integration into synchronous memory subsystems.
- Performance Supports a clock frequency of 143 MHz and an access time of 5.4 ns, enabling deterministic memory access in time-critical designs.
- Power Operating supply voltage range of 3.0 V to 3.6 V for compatibility with standard 3 V SDRAM power rails.
- Package 86-TSOP II (86-TFSOP, 0.400" / 10.16 mm width) surface-mount package suitable for compact board layouts.
- Operating Temperature Specified ambient range −40°C to 85°C for deployments across a broad environmental envelope.
- Volatile Memory Data is stored in volatile DRAM cells; device requires refresh and system management consistent with SDRAM operation.
Typical Applications
- Parallel memory subsystems Used where a 64 Mbit, 32-bit wide parallel SDRAM is required for buffering or working memory.
- Embedded systems Suitable for designs that need synchronous parallel DRAM with specified timing and supply characteristics.
- Compact board-level designs TSOP II packaging enables higher-density PCB routing in space-constrained assemblies.
Unique Advantages
- 32-bit wide organization: 2M × 32 layout provides a wide data path that can reduce the number of devices needed for certain memory widths.
- Defined timing performance: 143 MHz clock rating with 5.4 ns access time offers predictable synchronous access for time-sensitive applications.
- Standard 3 V supply compatibility: 3.0 V–3.6 V operating range aligns with common 3 V SDRAM power rails for straightforward power design.
- Extended ambient range: −40°C to 85°C operating temperature supports deployment across a wide range of environmental conditions.
- Compact TSOP II package: 86-TSOP II (10.16 mm width) provides a compact surface-mount footprint for dense PCB layouts.
- Manufacturer support: Available from Integrated Silicon Solution Inc (ISSI), ensuring access to device documentation and specifications.
Why Choose IS45S32200L-7TLA1-TR?
The IS45S32200L-7TLA1-TR combines a 64 Mbit SDRAM core organized as 2M × 32 with defined synchronous timing (143 MHz clock, 5.4 ns access) and a compact 86-TSOP II package, offering a straightforward memory building block for systems that require a parallel SDRAM solution. Its 3.0 V–3.6 V supply range and −40°C to 85°C operating temperature make it suitable for designs needing stable behavior across common industrial temperature ranges.
This device is appropriate for engineers specifying a verified parallel SDRAM component from ISSI where predictable timing, a wide data bus, and compact packaging are key selection criteria.
If you need pricing or availability information, request a quote or submit an inquiry to obtain a formal quotation and lead-time details for the IS45S32200L-7TLA1-TR.