IS45S32200L-7TLA2
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 1,068 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S32200L-7TLA2 – IC DRAM 64MBIT PAR 86TSOP II
The IS45S32200L-7TLA2 is a 64 Mbit volatile SDRAM device organized as 2M × 32 with a parallel memory interface. It provides high-speed memory access with a clock frequency rating of 143 MHz and an access time of 5.4 ns.
Packaged in an 86‑TSOP II (86‑TFSOP, 0.400", 10.16 mm width) footprint and rated for an operating temperature range of −40°C to 105°C, this device suits designs that require a compact parallel DRAM solution operating from a 3.0 V to 3.6 V supply.
Key Features
- Memory Core SDRAM architecture with a 64 Mbit capacity organized as 2M × 32 for wide‑bus parallel memory applications.
- Performance Supports a clock frequency up to 143 MHz with a specified access time of 5.4 ns to enable fast read/write cycles.
- Interface Parallel memory interface compatible with 32‑bit data bus configurations.
- Power Operates from a 3.0 V to 3.6 V supply range.
- Package Supplied in an 86‑TSOP II (86‑TFSOP, 0.400", 10.16 mm width) package for compact board integration.
- Environmental & Reliability Specified operating ambient temperature range from −40°C to 105°C (TA).
- Memory Type Volatile DRAM suitable for temporary data storage and buffering.
Typical Applications
- Parallel memory systems Use as system memory where a 32‑bit parallel SDRAM interface and 64 Mbit capacity are required.
- Compact PCB designs Integration into designs that require a small TSOP II footprint for space‑constrained layouts.
- Extended temperature environments Deployment in equipment operating across a wide ambient range, supported by the −40°C to 105°C rating.
Unique Advantages
- Wide data bus organization: The 2M × 32 arrangement delivers a 32‑bit parallel data path for efficient wide‑word transfers.
- High speed capability: 143 MHz clock rating and 5.4 ns access time enable rapid memory transactions where low latency matters.
- Compact TSOP II package: 86‑TSOP II footprint (0.400", 10.16 mm width) helps minimize board area for space‑sensitive applications.
- Wide operating voltage range: Compatibility with 3.0 V to 3.6 V systems supports common 3 V power rails.
- Extended temperature range: −40°C to 105°C rating supports use in thermally demanding environments.
Why Choose IS45S32200L-7TLA2?
The IS45S32200L-7TLA2 positions itself as a straightforward, high‑speed 64 Mbit parallel SDRAM option for designs that need a 32‑bit wide memory interface in a compact TSOP II package. Its combination of 143 MHz clock support, 5.4 ns access time, and broad operating temperature range offers a balance of performance and environmental robustness.
This device is well suited to engineers specifying parallel SDRAM for systems with 3.0–3.6 V supply rails and constrained PCB space, providing a clear, verifiable spec set for integration and long‑term design planning.
If you would like pricing, lead‑time information or a formal quote for the IS45S32200L-7TLA2, please request a quote or contact sales to submit your requirements.
