IS45S32200L-7TLA1
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 1,191 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S32200L-7TLA1 – IC DRAM 64MBIT PAR 86TSOP II
The IS45S32200L-7TLA1 is a 64 Mbit volatile SDRAM device organized as 2M × 32 with a parallel memory interface. It provides synchronous DRAM performance with a clock frequency of 143 MHz and an access time of 5.4 ns.
This device is supplied in an 86-TSOP II (86-TFSOP, 0.400", 10.16 mm width) package, operates from 3.0 V to 3.6 V, and supports an ambient operating temperature range of −40°C to 85°C.
Key Features
- Memory Architecture 64 Mbit SDRAM organized as 2M × 32, providing a parallel DRAM format for systems that require synchronous dynamic memory.
- Performance Synchronous SDRAM operation at a clock frequency of 143 MHz with an access time of 5.4 ns for deterministic read/write timing.
- Voltage and Power Operates from 3.0 V to 3.6 V, matching standard 3 V-class system supplies.
- Interface Parallel memory interface suitable for integration into parallel DRAM memory buses.
- Package Available in 86-TSOP II (86-TFSOP) package with a 0.400" (10.16 mm) width for compact board-level implementation.
- Temperature Range Specified for operation from −40°C to 85°C (TA) to support a broad range of ambient conditions.
Unique Advantages
- Mid-density memory in a compact package: 64 Mbit capacity organized as 2M × 32 delivers a balance of density and board footprint using the 86-TSOP II package.
- Synchronous operation with defined timing: 143 MHz clock and 5.4 ns access time provide explicit timing characteristics for system memory design.
- 3.0 V–3.6 V supply compatibility: Supports common 3 V system rails for straightforward power management integration.
- Parallel DRAM interface: Enables direct connection to parallel memory controllers and legacy parallel-memory architectures.
- Extended ambient temperature support: −40°C to 85°C operating range accommodates a wide set of environmental conditions.
Why Choose IS45S32200L-7TLA1?
The IS45S32200L-7TLA1 positions itself as a straightforward SDRAM building block for designs that require a 64 Mbit parallel DRAM with defined synchronous timing, compact TSOP II packaging, and 3.0 V-class power operation. Its specification set—2M × 32 organization, 143 MHz clock, 5.4 ns access time, and −40°C to 85°C operating range—makes it suitable for systems that need predictable SDRAM performance and a compact footprint.
This device is appropriate for designers and procurement teams seeking a documented SDRAM component with clear electrical, timing, and packaging specifications to support board-level memory implementations.
Request a quote or contact sales to check availability, lead times, and volume pricing for the IS45S32200L-7TLA1.