IS45S32200L-7BLA1
| Part Description |
IC DRAM 64MBIT PAR 90TFBGA |
|---|---|
| Quantity | 1,864 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S32200L-7BLA1 – IC DRAM 64MBIT PAR 90TFBGA
The IS45S32200L-7BLA1 is a 64 Mbit volatile DRAM organized as 2M × 32, implemented as SDRAM with a parallel memory interface. It provides a clock frequency of 143 MHz and an access time of 5.4 ns, and is offered in a 90‑TFBGA (8×13) package for board-mounted applications.
This device is suited for designs that require external parallel SDRAM memory with operation from a 3.0 V to 3.6 V supply and an ambient temperature range of -40°C to 85°C.
Key Features
- Memory Core 64 Mbit capacity organized as 2M × 32, implemented as SDRAM for parallel memory access.
- Performance 143 MHz clock frequency and 5.4 ns access time as specified for timing-sensitive memory operations.
- Voltage Operates from a 3.0 V to 3.6 V supply range, matching common 3 V memory power domains.
- Interface Parallel memory interface suitable for systems designed to use parallel SDRAM devices.
- Package 90‑TFBGA (8×13) supplier device package for surface mounting on printed circuit boards.
- Operating Temperature Specified ambient operating range of -40°C to 85°C (TA), supporting deployments across a broad temperature envelope.
Typical Applications
- Parallel SDRAM subsystems — Use as external DRAM in boards and modules that require a 2M × 32 parallel SDRAM device.
- Embedded memory expansion — Provides 64 Mbit of volatile SDRAM for designs needing external memory capacity with defined timing and voltage.
- Industrial-temperature systems — Suitable for systems that must operate across -40°C to 85°C ambient temperatures.
Unique Advantages
- Compact 90‑TFBGA packaging: 90‑ball TFBGA (8×13) format facilitates surface-mount integration on space-conscious PCBs.
- Defined performance metrics: 143 MHz clock frequency and 5.4 ns access time provide clear timing characteristics for system design and verification.
- Standard 3.0–3.6 V supply: Compatible with common 3 V memory power rails, simplifying power supply selection.
- Parallel 2M × 32 organization: Native organization delivers 64 Mbit capacity in a parallel SDRAM configuration for straightforward interface mapping.
- Wide operating temperature range: -40°C to 85°C specified ambient range supports a variety of deployment environments.
Why Choose IS45S32200L-7BLA1?
The IS45S32200L-7BLA1 by ISSI is positioned as a straightforward 64 Mbit parallel SDRAM device with clear electrical and timing specifications—143 MHz clocking, 5.4 ns access time, and a 3.0–3.6 V supply range—delivered in a 90‑TFBGA (8×13) package. These attributes make it appropriate for designs that require defined SDRAM timing, a parallel interface, and operation across a wide ambient temperature range.
This device is suitable for engineers and procurement teams specifying external DRAM for board-level memory expansion where the listed capacity, package, voltage, timing, and temperature characteristics meet system requirements.
Request a quote or submit an inquiry to check availability and pricing for the IS45S32200L-7BLA1.