IS46DR16160B-3DBLA1

The IS46DR16160B-3DBLA1 is a 256Mbit synchronous dynamic random access memory (SDRAM) built on Double Data Rate 2 (DDR2) technology. With a 16M x 16 memory organization and 333MHz clock frequency, this device provides reliable volatile memory storage for embedded systems requiring high-speed data access. Designed for industrial applications, this DRAM operates across an extended temperature range and delivers consistent performance in demanding environments.

Key Features

• DDR2 SDRAM Technology - Double data rate architecture transfers data on both rising and falling clock edges, achieving 333MHz clock speeds with 4.5ns access time for responsive system performance.
• 256Mbit Memory Capacity - 16M x 16 organization provides 32MB of volatile storage, offering balanced capacity for embedded applications without excessive power consumption or board space.
• Industrial Temperature Range - Rated for -40°C to 85°C operation, ensuring reliable memory retention and access across the full spectrum of industrial and outdoor deployment conditions.
• Low Voltage Operation - 1.7V to 1.9V supply voltage reduces power consumption compared to earlier DRAM generations, supporting energy-efficient designs and thermal management.
• Compact TWBGA Package - 84-pin thin very fine-pitch ball grid array (8mm x 12.5mm) minimizes PCB footprint while providing robust electrical connections for high-reliability applications.
• 15ns Write Cycle Time - Fast write cycles enable efficient data storage in applications with frequent memory updates, supporting real-time processing requirements.

Typical Applications

• Industrial Automation Systems - This DDR2 SDRAM serves as main memory in programmable logic controllers (PLCs) and distributed control systems where the extended temperature rating ensures consistent operation in factory floor environments subject to temperature variation.
• Networking Equipment - Routers, switches, and network attached storage devices utilize this memory for packet buffering and routing table storage, where the 333MHz clock speed supports wire-speed processing of network traffic.
• Embedded Computing Platforms - Single-board computers and embedded modules integrate this DRAM for application memory and data caching, benefiting from the balance of capacity, speed, and power efficiency in space-constrained designs.
• Instrumentation and Test Equipment - Measurement instruments and automated test systems employ this memory for waveform capture and data acquisition buffering, where reliable operation across temperature extremes maintains measurement accuracy in varied deployment settings.
• Point-of-Sale Terminals - Retail transaction systems and payment terminals use this DRAM for application processing and temporary data storage, where the compact package fits within slim terminal form factors.

Unique Advantages

• Extended Temperature Qualification: The -40°C to 85°C operating range eliminates the need for thermal management hardware in many industrial deployments, reducing both BOM cost and design complexity.
• Proven DDR2 Ecosystem: Mature controller IP and widespread chipset support simplify board design and reduce development risk compared to migrating to newer memory technologies for existing platforms.
• Optimized Power Profile: Lower supply voltage compared to DDR1 generation reduces both active and standby power consumption, extending battery life in portable equipment and lowering cooling requirements.
• Compact Footprint: The small TWBGA package conserves precious PCB area in space-constrained industrial and embedded designs, enabling higher component density without sacrificing memory capacity.
• Active Production Status: Current lifecycle status ensures reliable long-term availability for designs requiring extended production runs and multi-year field support commitments.
• Parallel Interface Compatibility: Standard parallel memory interface integrates seamlessly with existing embedded processor architectures and controller designs without requiring protocol conversion or bridge components.

Why Choose IS46DR16160B-3DBLA1?

This DDR2 SDRAM is positioned for embedded and industrial designs that prioritize proven technology, extended temperature operation, and long-term availability over cutting-edge performance. The 256Mbit capacity hits the sweet spot for applications requiring more than basic SRAM but not demanding the higher densities of larger DRAM devices, while the industrial temperature rating expands deployment opportunities beyond office-environment equipment.

For design teams maintaining legacy platforms or developing new products around established processor architectures with DDR2 support, this device offers a stable, cost-effective memory solution backed by ISSI's position as a specialized memory supplier. The combination of reasonable speed, low power operation, and compact packaging makes it particularly well-suited for space and power-constrained industrial equipment expected to operate reliably over years of continuous service.

Get a Quote Today

Contact our technical sales team to discuss your memory requirements and request pricing for the IS46DR16160B-3DBLA1. Our application engineers can assist with integration guidance, reference designs, and volume availability to support your development timeline.