IS46DR16320E-25DBLA2-TR

The IS46DR16320E-25DBLA2-TR is a 512 Mbit DDR2 SDRAM device organized as 32M × 16 with a parallel memory interface. It provides volatile DRAM storage with a 400 MHz clock frequency and is supplied in a compact 84-ball BGA package suitable for space-constrained board designs.

Key device characteristics include DDR2 memory technology, low-voltage operation (1.7 V to 1.9 V), a 400 ps access time, and an extended operating temperature range of -40°C to 105°C, making it suitable for systems that require stable DRAM performance across a wide temperature span.

Key Features

• Memory Type & Organization Volatile DRAM implemented as DDR2 SDRAM with a 32M × 16 organization and a total memory size of 512 Mbit.
• Performance Supports a 400 MHz clock frequency with a specified access time of 400 ps and a write cycle time (word page) of 15 ns.
• Power Low-voltage operation with a supply range of 1.7 V to 1.9 V, enabling integration with low-voltage system domains.
• Interface Parallel memory interface compatible with standard DDR2 memory signaling and timing requirements.
• Package & Mounting Available in an 84-ball thin BGA package: Supplier device package listed as 84-TWBGA (8×12.5). Package case is specified as 84-TFBGA.
• Operating Temperature Industrial temperature range from -40°C to 105°C (TA) for operation across varied environmental conditions.

Typical Applications

• Embedded Systems — Provides parallel DDR2 DRAM storage for embedded designs requiring 512 Mbit memory capacity and standard DDR2 timing.
• Industrial Equipment — Suitable for systems that need DRAM operation across a wide temperature range (-40°C to 105°C).
• Compact Board-Level Memory — BGA packaging (84-ball, 8×12.5) supports small-footprint board layouts where space is constrained.

Unique Advantages

• 400 MHz Clock Support: Enables DDR2 operation at rated clock frequency for designs specifying this timing.
• 32M × 16 Organization: Provides a straightforward parallel memory architecture for systems designed around 16-bit data paths.
• Low-Voltage Operation: 1.7 V to 1.9 V supply reduces system power domain requirements and supports low-voltage designs.
• Extended Temperature Range: -40°C to 105°C rating supports deployment in environments with wide temperature variations.
• Compact BGA Footprint: 84-ball TWBGA (8×12.5) package enables dense PCB integration and surface-mount assembly.

Why Choose IS46DR16320E-25DBLA2-TR?

The IS46DR16320E-25DBLA2-TR combines DDR2 memory architecture with a 32M × 16 organization and 512 Mbit capacity to deliver a predictable, parallel DRAM option for board-level memory needs. Its 400 MHz clock capability, 400 ps access time and 15 ns write cycle time address timing-sensitive designs while operating at a low voltage of 1.7 V to 1.9 V.

This device is suitable for engineers specifying compact BGA-mounted DRAM with an extended operating temperature range, offering a clear, verifiable set of electrical and mechanical characteristics for integration into production systems.

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