IS46R16160F-6BLA1

IC DRAM 256MBIT PAR 60TFBGA
Part Description

IC DRAM 256MBIT PAR 60TFBGA

Quantity 220 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeIndustrial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS46R16160F-6BLA1 - 256Mbit DDR SDRAM

The IS46R16160F-6BLA1 is a 256-megabit synchronous dynamic random access memory (SDRAM) device utilizing DDR (Double Data Rate) technology. Organized as 16M x 16, this parallel-interface memory delivers reliable data storage and retrieval at 166MHz clock frequency with 0.7ns access time. Designed for extended temperature operation from -40°C to 85°C, this memory IC serves industrial, networking, and embedded computing applications requiring robust performance in challenging environments.

Key Features

  • DDR SDRAM Architecture - Double data rate operation transfers data on both rising and falling clock edges, effectively doubling bandwidth compared to single data rate SDRAM while maintaining the same clock frequency.
  • Memory Configuration - 256Mbit capacity organized as 16 million words by 16 bits provides flexible data width for various system architectures, supporting efficient 16-bit parallel data transfers.
  • High-Speed Performance - 166MHz clock frequency with 0.7ns access time and 15ns write cycle time enables fast data throughput for time-sensitive applications.
  • Power Supply - Operates on 2.3V to 2.7V supply voltage, compatible with standard low-voltage logic levels and reducing overall system power consumption.
  • Industrial Temperature Range - Qualified for -40°C to 85°C ambient temperature operation, ensuring reliable performance across industrial, automotive, and outdoor deployment scenarios.
  • Compact Package - 60-ball TFBGA (8mm x 13mm) footprint maximizes board space efficiency in space-constrained designs.

Typical Applications

  • Industrial Automation Systems - This DDR SDRAM provides high-speed data buffering for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and motion control systems where the extended temperature range ensures reliable operation in factory floor environments subject to temperature variations.
  • Networking Equipment - Serves as packet buffer memory in routers, switches, and network appliances where the 166MHz operation supports wire-speed packet processing and the parallel interface simplifies integration with network processors.
  • Embedded Computing Platforms - Functions as main system memory in industrial computers, single-board computers, and embedded controllers where the compact TFBGA package conserves valuable board real estate.
  • Telecommunications Infrastructure - Provides data storage for base stations, access points, and telecommunications equipment deployed in outdoor cabinets where the industrial temperature rating accommodates environmental temperature swings.
  • Test and Measurement Instruments - Offers high-speed data acquisition buffering in oscilloscopes, logic analyzers, and automated test equipment where fast write cycles prevent data loss during continuous sampling operations.

Unique Advantages

  • Extended Temperature Reliability: The -40°C to 85°C operating range eliminates the need for additional thermal management in many industrial applications, reducing system complexity and BOM costs.
  • DDR Efficiency: Double data rate operation delivers twice the effective bandwidth of single data rate memories at the same clock frequency, improving system throughput without increasing power consumption or EMI.
  • 16-Bit Parallel Interface: Direct parallel data bus eliminates the overhead and complexity of serial interfaces, simplifying firmware development and reducing processor load in embedded systems.
  • Proven SDRAM Technology: Leverages mature and widely-supported DDR SDRAM architecture with extensive ecosystem of compatible controllers and reference designs, accelerating time-to-market.
  • Space-Optimized Footprint: The 60-ball TFBGA package (8mm x 13mm) provides high pin density in a compact form factor, enabling memory expansion without sacrificing board area for other critical components.
  • Standard Voltage Operation: 2.3V to 2.7V supply compatibility allows direct interfacing with common logic families and microcontrollers without level translation, simplifying power supply design.

Why Choose IS46R16160F-6BLA1?

The IS46R16160F-6BLA1 addresses the specific requirements of industrial and embedded applications where standard commercial-grade memories may not provide adequate environmental tolerance. With its combination of DDR performance, industrial temperature qualification, and compact packaging, this memory IC is ideally suited for designs that must operate reliably in variable environmental conditions while maintaining high data throughput. The parallel interface and proven DDR SDRAM architecture ensure straightforward integration with existing controller designs and reduce development risk.

For applications demanding both performance and environmental robustness, the IS46R16160F-6BLA1 delivers a balance of speed, capacity, and reliability in a space-efficient package that simplifies system design while meeting the operational demands of industrial deployment.

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