MT29F32G08ABCABH1-10Z:A

IC FLASH 32GBIT PARALLEL 100VBGA
Part Description

IC FLASH 32GBIT PARALLEL 100VBGA

Quantity 1,130 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08ABCABH1-10Z:A – IC FLASH 32GBIT PARALLEL 100VBGA

The MT29F32G08ABCABH1-10Z:A is a 32 Gbit non-volatile NAND flash memory device in a 100-ball VBGA package. It implements parallel NAND architecture with SLC technology and is intended for systems that require high-density, parallel flash storage in a compact BGA footprint.

This device targets designs requiring large-capacity, page/block-organized NAND storage with support for both asynchronous and synchronous I/O modes. Key value comes from its high endurance, ONFI 2.2 protocol support, and a package optimized for space-constrained commercial applications.

Key Features

  • Memory Type & Capacity – 32 Gbit NAND flash organized as 4G × 8, providing a high-density non-volatile storage element for embedded systems.
  • Cell Technology – Single-level cell (SLC) technology as specified in the datasheet, offering device-level endurance characteristics.
  • Organization & Geometry – Page size (x8): 8,640 bytes (8,192 + 448); block size: 128 pages (1,024K + 56K bytes); device includes 4,096 blocks for the 32Gb density.
  • Interface & Protocol – Parallel memory interface with ONFI 2.2 compliance and support for asynchronous and synchronous command sets; data strobe (DQS) signals supported for synchronous operation.
  • Performance – Supports synchronous I/O up to timing mode 5 with DDR timing (10 ns); synchronous read/write throughput per pin up to 200 MT/s and asynchronous throughput per pin up to 50 MT/s. Specified clock frequency: 100 MHz.
  • Power & Voltage – VCC operating range: 2.7–3.6 V; VCCQ supported ranges include 1.7–1.95 V and 2.7–3.6 V.
  • Package – 100-ball VBGA (12 × 18) package case, enabling compact board-level integration.
  • Operating Temperature – Commercial temperature range: 0 °C to +70 °C (TA).
  • Command & Advanced Features – ONFI NAND command set with program/read/erase operations, program cache, read cache (sequential and random), multi-plane commands, multi-LUN operations, copyback, read unique ID, and an OTP mode. RESET (FFh) is required as the first command after power-on.
  • Quality & Reliability – Data retention referenced to JESD47G; endurance rated at 80,000 program/erase cycles.

Typical Applications

  • Commercial Embedded Systems – Use as primary non-volatile storage where a 32 Gbit parallel NAND device in a compact BGA package is required.
  • Firmware and Code Storage – Store boot images, firmware, and OS components using organized page/block architecture and supported command features.
  • High-Density Parallel NAND Implementations – Suitable for designs that integrate parallel ONFI 2.2 NAND devices with synchronous/asynchronous operation.

Unique Advantages

  • High-density SLC NAND: 32 Gbit capacity in a 4G × 8 organization provides substantial non-volatile storage in a single device.
  • Flexible I/O modes: Supports both asynchronous and synchronous operation with ONFI 2.2 compliance and DQS support for synchronized data transfers.
  • Compact BGA package: 100-ball VBGA (12 × 18) enables space-efficient PCB layout for compact systems.
  • Extended endurance: Rated for 80,000 program/erase cycles, supporting applications with frequent write/erase activity.
  • Comprehensive command set: Advanced commands (program cache, read cache, multi-plane, copyback, OTP) simplify data management and improve throughput for multi-plane operations.
  • Commercial temperature suitability: Specified operating range of 0 °C to +70 °C for typical commercial deployments.

Why Choose IC FLASH 32GBIT PARALLEL 100VBGA?

The MT29F32G08ABCABH1-10Z:A is positioned for commercial embedded designs that demand a high-density, reliable parallel NAND flash device with SLC-level endurance and ONFI 2.2 protocol support. Its combination of synchronous/asynchronous operation modes, DQS support, and advanced command features make it suitable for systems that require controlled performance and robust data-management capabilities.

Engineers specifying this device gain a compact 100-ball VBGA package, broad voltage support (VCC and VCCQ options), and documented quality attributes such as JESD47G-referenced data retention and 80,000 P/E cycle endurance—providing a clear technical foundation for long-term storage needs.

Request a quote or contact sales to check availability, discuss lead times, or request samples for evaluation.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up