MT29F64G08AJABAWP-IT:B
| Part Description |
IC FLASH 64GBIT PAR 48TSOP I |
|---|---|
| Quantity | 199 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08AJABAWP-IT:B – IC FLASH 64GBIT PAR 48TSOP I
The MT29F64G08AJABAWP-IT:B is a non-volatile NAND flash memory device providing 64 Gbit of parallel flash storage. It is organized as 8G × 8 and is supplied in a 48-TSOP I package.
Designed for applications that require parallel NAND flash memory with a 2.7 V to 3.6 V supply and an operating temperature range of −40 °C to 85 °C, this device offers a compact package option for board-level integration.
Key Features
- Memory Type & Technology Non-volatile NAND flash memory technology providing persistent storage.
- Capacity & Organization 64 Gbit capacity, organized as 8G × 8 for byte-wide parallel operation.
- Interface Parallel memory interface for direct bus-connected implementations.
- Voltage Supply Operates from 2.7 V to 3.6 V, suitable for standard 3.0 V system domains.
- Package 48-TFSOP (48-TSOP I) package with an 18.40 mm width (0.724") for surface-mount applications.
- Operating Temperature Rated for −40 °C to 85 °C ambient (TA) for use in moderate temperature environments.
- Mounting Type Surface-mount device supplied in 48-TSOP I format for PCB assembly.
- Manufacturer Micron Technology Inc.
Typical Applications
- Embedded non-volatile storage Provides parallel NAND flash capacity for systems requiring on-board persistent memory.
- Code and firmware storage Stores firmware or boot images where a parallel flash interface is used.
- Board-level data storage Offers high-density flash in a TSOP I package for compact PCB implementations.
Unique Advantages
- High density in a compact package: 64 Gbit capacity delivered in a 48-TSOP I footprint to maximize board-level storage without increasing PCB area.
- Byte-wide organization: 8G × 8 memory organization supports parallel byte-wide data paths for direct interfacing with parallel controllers.
- <strong_Wide supply range: Operates across 2.7 V to 3.6 V, allowing compatibility with common 3.0 V system power rails.
- Industrial temperature rating: Specified for −40 °C to 85 °C ambient to accommodate a range of temperature environments.
- Surface-mount readiness: 48-TSOP I package enables standard PCB assembly and placement processes.
Why Choose IC FLASH 64GBIT PAR 48TSOP I?
The MT29F64G08AJABAWP-IT:B combines a 64 Gbit NAND flash architecture with a parallel interface and a compact 48-TSOP I package, providing a practical solution for designs that require on-board non-volatile storage within a defined voltage and temperature envelope. Its byte-wide organization and standard supply range make it suitable for systems designed around parallel flash memory.
Manufactured by Micron Technology Inc., this device is appropriate for engineers and procurement teams specifying parallel NAND flash where package size, capacity, supply voltage, and operating temperature are key selection criteria.
Request a quote or submit an inquiry for pricing and availability of the MT29F64G08AJABAWP-IT:B to evaluate it for your next design.
