MT29F64G08CBEDBJ4-12:D TR

IC FLASH 64GBIT PAR 132VBGA
Part Description

IC FLASH 64GBIT PAR 132VBGA

Quantity 67 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT29F64G08CBEDBJ4-12:D TR – 64 Gbit Parallel NAND Flash, 132-VBGA

The MT29F64G08CBEDBJ4-12:D TR is a 64 Gbit non-volatile FLASH memory device using NAND technology. It is organized as 8G × 8 and provides a parallel memory interface in a 132-VBGA (12 × 18) package.

This device targets designs that require large-capacity parallel FLASH storage with a defined commercial operating range and standard 3.0 V class supply voltage.

Key Features

  • Memory Type & Architecture 64 Gbit NAND FLASH organized as 8G × 8 for parallel data access and mass non-volatile storage.
  • Interface Parallel memory interface suitable for systems requiring parallel FLASH communication.
  • Clock Performance Supports an 83 MHz clock frequency for synchronous operation at the specified rate.
  • Voltage Supply Operates from 2.7 V to 3.6 V, compatible with standard 3.0 V system power rails.
  • Package Supplied in a 132-VBGA package (12 × 18 mm) that provides a compact footprint for board-level integration.
  • Operating Temperature Rated for a commercial temperature range of 0°C to 70°C (TA).
  • Memory Format FLASH memory format optimized for non-volatile code and data storage.

Typical Applications

  • Embedded Storage — Provides 64 Gbit of parallel NAND FLASH for embedded systems requiring large non-volatile memory capacity.
  • Firmware and Boot Storage — Suitable for storing firmware images and boot code with parallel access in system controllers.
  • Mass Data Storage — Acts as high-density non-volatile memory for designs that use parallel FLASH for bulk data retention.

Unique Advantages

  • High Capacity: 64 Gbit density supports large amounts of non-volatile data and code storage on a single device.
  • Parallel Interface: Parallel memory organization (8G × 8) enables integration into systems that require parallel FLASH access.
  • Standard Supply Voltage: 2.7 V to 3.6 V operation aligns with common 3.0 V system power domains.
  • Compact VBGA Package: 132-VBGA (12 × 18 mm) footprint simplifies board layout while providing high pin density.
  • Defined Commercial Temperature: Rated for 0°C to 70°C, matching typical commercial application environments.

Why Choose IC FLASH 64GBIT PAR 132VBGA?

The MT29F64G08CBEDBJ4-12:D TR delivers a straightforward, high-density NAND FLASH option for designs that require parallel-access non-volatile memory in a compact VBGA package. With a 64 Gbit capacity, 8G × 8 organization, and an 83 MHz clock rating, it meets needs for large memory footprints on 3.0 V class systems within a commercial temperature range.

Manufactured by Micron Technology Inc., this device is suitable for engineers and procurement teams seeking a verified parallel FLASH memory component for applications that align with its specified voltage and temperature characteristics.

Request a quote or contact sales to discuss availability, pricing, and lead times for the MT29F64G08CBEDBJ4-12:D TR.

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