MT29F64G08CBEDBJ4-12M:D TR

IC FLASH 64GBIT PAR 132VBGA
Part Description

IC FLASH 64GBIT PAR 132VBGA

Quantity 576 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CBEDBJ4-12M:D TR – IC FLASH 64GBIT PAR 132VBGA

The MT29F64G08CBEDBJ4-12M:D TR is a 64 Gbit non-volatile FLASH NAND memory device organized as 8G × 8. It provides parallel memory access and is specified with an 83 MHz clock frequency for data transfers.

Packaged in a 132-VBGA (12×18) form factor and operating over a 2.7 V to 3.6 V supply range, this device is intended for systems that require high-density parallel NAND flash storage within commercial temperature limits.

Key Features

  • Memory Architecture  Non-volatile FLASH NAND memory with a total capacity of 64 Gbit organized as 8G × 8.
  • Interface & Performance  Parallel memory interface with an 83 MHz clock frequency for synchronous data access.
  • Power  Wide supply voltage range from 2.7 V to 3.6 V to support common system power rails.
  • Package & Mounting  132-VBGA package (12×18) providing a compact BGA footprint for board-level integration.
  • Operating Conditions  Specified ambient operating temperature range of 0°C to 70°C (TA).
  • Memory Format & Technology  FLASH - NAND technology providing non-volatile storage.

Unique Advantages

  • High-density storage: 64 Gbit capacity delivers substantial non-volatile storage in a single device, reducing the need for multiple memory components.
  • Parallel interface: Parallel memory access with an 83 MHz clock enables straightforward integration into systems designed for parallel NAND devices.
  • Flexible power compatibility: 2.7 V to 3.6 V supply range supports common system voltage levels for simplified power design.
  • Compact BGA package: 132-VBGA (12×18) package minimizes board area while providing a BGA mounting approach for reliable solder connections.
  • Commercial temperature rating: 0°C–70°C operating range aligns with commercial-environment applications and system requirements.

Why Choose MT29F64G08CBEDBJ4-12M:D TR?

This device is positioned as a high-density parallel NAND flash memory solution that balances storage capacity, board-level compactness, and straightforward power requirements. Its combination of 64 Gbit capacity, parallel interface at 83 MHz, and a 132-VBGA package makes it suitable for designs that require a single-component non-volatile memory solution within commercial temperature limits.

The MT29F64G08CBEDBJ4-12M:D TR is appropriate for customers needing predictable electrical and thermal characteristics, compact packaging, and a standard parallel NAND memory architecture to integrate into existing system designs.

Request a quote or contact sales to inquire about availability, pricing, and lead times for the MT29F64G08CBEDBJ4-12M:D TR.

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