MT29F64G08CECCBH1-12Z:C

IC FLASH 64GBIT PARALLEL 100VBGA
Part Description

IC FLASH 64GBIT PARALLEL 100VBGA

Quantity 261 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CECCBH1-12Z:C – IC FLASH 64GBIT PARALLEL 100VBGA

The MT29F64G08CECCBH1-12Z:C is a 64 Gbit non-volatile NAND flash memory device from Micron Technology Inc. It uses FLASH – NAND technology with an 8G × 8 memory organization and a parallel memory interface.

Designed for applications requiring high-density parallel flash, the device offers an 83 MHz clock frequency, a 2.7 V–3.6 V supply range, and a compact 100-VBGA (12×18) package. The specified operating ambient temperature range is 0°C–70°C.

Key Features

  • Memory Type Non-volatile FLASH – NAND memory providing 64 Gbit of storage capacity in an 8G × 8 organization.
  • Interface & Timing Parallel memory interface with a clock frequency of 83 MHz for synchronous operation with parallel host controllers.
  • Power Operating supply voltage range of 2.7 V to 3.6 V to accommodate common 3 V system rails.
  • Package & Mounting Supplied in a 100-VBGA package (12×18 mm) suitable for board-level surface mounting.
  • Operating Temperature Commercial ambient temperature rating of 0°C to 70°C (TA).
  • Manufacturer Produced by Micron Technology Inc., identified as part number MT29F64G08CECCBH1-12Z:C.

Unique Advantages

  • High-density storage: 64 Gbit capacity supports substantial on-board data storage without external devices.
  • Parallel interface: Parallel memory interface enables direct integration with systems designed for parallel NAND flash.
  • Flexible supply range: 2.7 V–3.6 V operation fits standard 3 V power domains.
  • Compact BGA footprint: 100-VBGA (12×18) package reduces board area while maintaining high-pin integration.
  • Vendor-backed device: Manufactured by Micron Technology Inc., providing supply-chain traceability to the listed manufacturer.
  • Commercial temperature rating: 0°C–70°C ambient range suitable for standard commercial applications.

Why Choose MT29F64G08CECCBH1-12Z:C?

The MT29F64G08CECCBH1-12Z:C positions itself as a high-capacity parallel NAND flash option that combines 64 Gbit density, a parallel interface, and industry-standard supply-voltage compatibility. Its 100-VBGA (12×18) package and commercial temperature rating make it suitable for space-conscious, board-mounted designs operating in standard ambient conditions.

Engineers and procurement teams seeking a Micron-manufactured parallel NAND flash device with clearly specified electrical, package, and temperature characteristics can consider this part for designs that require verified capacity and defined operating parameters.

Request a quote or contact sales to discuss pricing, availability, and lead times for MT29F64G08CECCBH1-12Z:C.

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