MT29F64G08CFACAWP-Z:C
| Part Description |
IC FLASH 64GBIT PAR 48TSOP I |
|---|---|
| Quantity | 264 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F64G08CFACAWP-Z:C – IC FLASH 64GBIT PAR 48TSOP I
The MT29F64G08CFACAWP-Z:C is a 64 Gbit non-volatile NAND flash memory organized as 8G × 8 with a parallel interface. It is supplied in a 48-TSOP I package and operates from a 2.7 V to 3.6 V supply.
This device is intended for designs that require parallel NAND flash storage within a commercial temperature range (0°C to 70°C), offering a compact package option and straightforward parallel bus integration.
Key Features
- Memory Type Non-volatile NAND flash memory providing persistent storage without power.
- Density & Organization 64 Gbit memory capacity organized as 8G × 8 to support byte-wide parallel data transfers.
- Interface Parallel memory interface suitable for systems designed to use parallel NAND devices.
- Voltage Supply Operates from 2.7 V to 3.6 V, allowing use with common 3 V system power rails.
- Package 48-TFSOP / 48-TSOP I package (0.724", 18.40 mm width) for compact board-level integration.
- Operating Temperature Commercial temperature range of 0°C to 70°C for typical commercial and consumer applications.
Typical Applications
- Embedded systems — Provides non-volatile parallel NAND storage for embedded designs that require 64 Gbit capacity in a TSOP package.
- Firmware and code storage — Stores boot code or firmware images where a parallel flash interface and commercial temperature range are appropriate.
- Consumer and commercial electronics — Used in devices that require compact, high-density NAND flash with a 48-TSOP I footprint and 3 V-class supply.
- Controller storage expansion — Adds parallel flash capacity to controllers and processors designed for an 8-bit parallel NAND interface.
Unique Advantages
- 64 Gbit capacity: Provides substantial non-volatile storage density in a single-device solution.
- Byte-wide organization (8G × 8): Supports straightforward byte-oriented parallel data access for compatible system architectures.
- Parallel interface: Integrates with systems that use parallel NAND buses without requiring serial-to-parallel conversion.
- Wide supply range: 2.7 V to 3.6 V support accommodates common 3 V supply domains.
- Compact TSOP footprint: The 48-TSOP I package (0.724", 18.40 mm width) enables high-density board layouts.
- Commercial temperature rating: Specified operation from 0°C to 70°C for consumer and commercial applications.
Why Choose MT29F64G08CFACAWP-Z:C?
The MT29F64G08CFACAWP-Z:C positions itself as a straightforward parallel NAND flash option when a 64 Gbit non-volatile memory in a compact 48-TSOP I package is required. Its 8G × 8 organization and parallel interface make it suitable for systems designed around byte-wide NAND connectivity and 3 V-class power rails.
This device is appropriate for designers and procurement teams targeting commercial and consumer product segments that need scalable flash capacity, compact packaging, and compatibility with 2.7 V–3.6 V system supplies.
Request a quote or submit an inquiry for pricing and availability of the MT29F64G08CFACAWP-Z:C.
