MT29F64G08CECCBH1-12Z:C TR

IC FLASH 64GBIT PARALLEL 100VBGA
Part Description

IC FLASH 64GBIT PARALLEL 100VBGA

Quantity 307 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CECCBH1-12Z:C TR – IC FLASH 64GBIT PARALLEL 100VBGA

The MT29F64G08CECCBH1-12Z:C TR is a 64 Gbit non-volatile flash memory device from Micron Technology Inc. It uses NAND flash architecture with an 8G × 8 memory organization and a parallel memory interface.

Offered in a 100‑VBGA (12×18) package and operating from a 2.7 V to 3.6 V supply at ambient temperatures from 0°C to 70°C, this device targets systems requiring high-density parallel flash storage with defined timing at an 83 MHz clock frequency.

Key Features

  • Memory Type & Technology Non-volatile FLASH NAND memory with a total capacity of 64 Gbit organized as 8G × 8.
  • Memory Interface & Timing Parallel memory interface with a specified clock frequency of 83 MHz for memory transactions.
  • Voltage Supply Operates across a 2.7 V to 3.6 V supply range to match common system power rails.
  • Package Supplied in a 100‑VBGA package (12×18) for compact board-level integration.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).
  • Memory Organization & Format Organized as 8G × 8 in a parallel FLASH memory format suitable for embedded storage implementations.

Typical Applications

  • Parallel NAND storage systems — Provides high-density non-volatile storage where a parallel flash interface is required.
  • Embedded devices — Integrates into embedded designs that need solid-state flash memory in a compact 100‑VBGA package.
  • Consumer electronics — Fits consumer products operating within the 0°C to 70°C ambient range that require NAND flash capacity and parallel access.

Unique Advantages

  • High-density 64 Gbit capacity: Supports large non-volatile storage requirements within a single device footprint.
  • Parallel interface with defined timing: The parallel memory interface and 83 MHz clock frequency provide predictable timing characteristics for system integration.
  • Wide supply voltage range: 2.7 V to 3.6 V operation enables compatibility with common system power rails.
  • Compact 100‑VBGA (12×18) package: Space-efficient packaging for board-level integration in size-constrained designs.
  • Ambient temperature rating: Specified for 0°C to 70°C operation to match a range of commercial applications.

Why Choose IC FLASH 64GBIT PARALLEL 100VBGA?

The MT29F64G08CECCBH1-12Z:C TR positions itself as a high-density parallel NAND flash device that balances capacity, interface compatibility, and compact packaging. Its 8G × 8 organization and 64 Gbit capacity make it suitable for designs that require substantial non-volatile storage in a 100‑VBGA package.

This device is appropriate for engineers and procurement teams specifying parallel NAND flash for embedded, storage, or consumer applications within a 0°C to 70°C ambient range and operating on 2.7 V to 3.6 V supplies. Its defined clock frequency and package details support straightforward integration into systems with parallel memory architectures.

Request a quote or submit an inquiry for pricing and availability of the MT29F64G08CECCBH1-12Z:C TR.

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