MT29F64G08CFACAWP-Z:C TR

IC FLASH 64GBIT PAR 48TSOP I
Part Description

IC FLASH 64GBIT PAR 48TSOP I

Quantity 1,357 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08CFACAWP-Z:C TR – 64Gbit Parallel NAND Flash, 48‑TSOP I

The MT29F64G08CFACAWP-Z:C TR is a 64 Gbit non‑volatile FLASH memory device based on NAND technology. It provides parallel memory organization and is supplied in a 48‑TSOP I package.

This device is intended for systems that require high‑density non‑volatile storage with a parallel interface, operating over a commercial temperature range and a standard 2.7 V to 3.6 V supply window.

Key Features

  • Memory Type & Technology Non‑volatile FLASH using NAND technology for bulk storage.
  • Density & Organization 64 Gbit total memory capacity with an 8G × 8 memory organization.
  • Interface Parallel memory interface for integration with parallel flash controller architectures.
  • Voltage Supply Operates from 2.7 V to 3.6 V, supporting standard single‑supply system designs.
  • Package Supplied in a 48‑TFSOP / 48‑TSOP I package (0.724" / 18.40 mm width) for compact board implementation.
  • Operating Temperature Commercial operating range of 0°C to 70°C (TA).
  • Memory Format FLASH memory format suitable for non‑volatile storage needs.

Unique Advantages

  • High storage density: 64 Gbit capacity provides substantial non‑volatile storage in a single device.
  • Byte‑organized memory: 8G × 8 organization aligns with parallel data handling requirements.
  • Parallel interface compatibility: Designed for systems that utilize parallel FLASH memory interfaces.
  • Standard supply range: 2.7 V to 3.6 V operation fits common system power rails.
  • Compact package: 48‑TSOP I package with 18.40 mm width enables space‑efficient PCB layouts.
  • Commercial temperature suitability: 0°C to 70°C rating supports a wide range of indoor and consumer applications.

Why Choose MT29F64G08CFACAWP-Z:C TR?

The MT29F64G08CFACAWP-Z:C TR provides a straightforward, high‑capacity parallel NAND FLASH option in an industry‑standard TSOP package. Its 64 Gbit density, 8G × 8 organization, and 2.7 V–3.6 V supply window make it suitable for designs that require substantial non‑volatile storage with a parallel interface and commercial temperature operation.

This device is a practical choice for engineers specifying parallel FLASH memory where board space, standard supply voltages, and a defined operating temperature range are primary considerations.

Request a quote or contact sales to discuss pricing, availability, and lead times for the MT29F64G08CFACAWP-Z:C TR.

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