MT29F64G08EBAAAWP-Z:A TR

IC FLASH 64GBIT PAR 48TSOP I
Part Description

IC FLASH 64GBIT PAR 48TSOP I

Quantity 1,062 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08EBAAAWP-Z:A TR – IC FLASH 64GBIT PAR 48TSOP I

The MT29F64G08EBAAAWP-Z:A TR is a non-volatile NAND flash memory device with a density of 64 Gbit organized as 8G × 8 and presented in a 48-TSOP I package. It provides a parallel memory interface and operates from a 2.7 V to 3.6 V supply voltage.

This device is intended for designs that require parallel NAND flash storage in a compact 48-TFSOP (0.724", 18.40 mm width) footprint and that operate within a 0°C to 70°C ambient temperature range.

Key Features

  • Memory Type: Non-volatile NAND flash technology providing persistent storage without power.
  • Memory Capacity & Organization: 64 Gbit capacity organized as 8G × 8 for byte-wide parallel access.
  • Interface: Parallel memory interface for direct parallel data connectivity.
  • Supply Voltage: Operates from 2.7 V to 3.6 V, compatible with single-supply 3.3 V system domains.
  • Package: 48-TFSOP / 48-TSOP I package (0.724" / 18.40 mm width) for compact board-level integration.
  • Operating Temperature: Rated for 0°C to 70°C (TA) ambient operation.

Unique Advantages

  • High-density storage: 64 Gbit capacity enables larger on-board data storage without adding external devices.
  • Byte-wide organization: 8G × 8 organization supports straightforward byte-oriented parallel access and addressing.
  • Wide supply range: 2.7 V to 3.6 V operation provides flexibility for systems using common 3.3 V supply rails.
  • Compact TSOP I footprint: 48-TSOP I package delivers a space-efficient form factor for PCB-constrained designs.
  • Commercial temperature rating: 0°C to 70°C specification aligns with a broad set of ambient operating environments.

Why Choose IC FLASH 64GBIT PAR 48TSOP I?

The MT29F64G08EBAAAWP-Z:A TR is positioned for applications requiring a 64 Gbit parallel NAND flash memory in a 48-TSOP I package, offering a clear combination of capacity, parallel interface, and a 2.7 V–3.6 V supply envelope. Its 8G × 8 organization and TSOP footprint make it suitable for system designs that need byte-wide parallel flash storage within a 0°C to 70°C operating range.

This device provides a straightforward integration path for designs specifying parallel NAND flash memory with defined package and voltage constraints, enabling predictable board-level implementation and capacity planning.

Request a quote or contact sales to discuss availability, pricing, and lead times for the MT29F64G08EBAAAWP-Z:A TR.

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