MT40A2G16SKL-062E:B
| Part Description |
IC DRAM 32GBIT PARALLEL 96FBGA |
|---|---|
| Quantity | 849 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 96-FBGA (10.5x13) | Memory Format | DRAM | Technology | SDRAM - DDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | 13.75 ns | Grade | Extended / Automotive-like | ||
| Clock Frequency | 1.6 GHz | Voltage | 1.14V ~ 1.26V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 96-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 2G x 16 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 8542.32.0071 |
Overview of MT40A2G16SKL-062E:B – IC DRAM 32GBIT PARALLEL 96FBGA
The MT40A2G16SKL-062E:B is a 32 Gbit DDR4 SDRAM device from the TwinDie™ series by Micron Technology Inc., delivered in a 96-FBGA (10.5 × 13 mm) package. It features a parallel memory interface and a 2G × 16 organization suitable for applications requiring high-density DDR4 memory in a compact footprint.
Key attributes reported in the product data include a 1.6 GHz clock frequency, an access time of 13.75 ns, support for a 1.14 V–1.26 V supply range, and an operating temperature range of 0 °C to 95 °C (TC), offering a combination of density, speed, and low-voltage operation for embedded memory designs.
Key Features
- Core & Architecture DDR4 SDRAM architecture in the TwinDie™ series with a 2G × 16 memory organization, providing a total memory size of 32 Gbit as specified in the product data.
- Performance Clock frequency listed at 1.6 GHz with an access time of 13.75 ns, enabling fast parallel read/write cycles per the provided specifications.
- Power Specified supply voltage range of 1.14 V to 1.26 V, allowing operation within a defined low-voltage DDR4 window according to the product data.
- Interface & Format Parallel memory interface and DRAM memory format as noted in the product information.
- Package & Mounting 96-FBGA package (10.5 × 13 mm) / 96-TFBGA package case with surface-mount mounting type reported in the product data.
- Environmental & Timing Operating temperature range specified as 0 °C to 95 °C (TC) and an access time of 13.75 ns, as provided in the product specifications.
- Memory Type (as listed) Memory type and mounting type are both listed in the product data as "Non-Volatile."
Unique Advantages
- High density — 32 Gbit: A single-device memory size of 32 Gbit simplifies board-level memory capacity planning where compact, high-density memory is required.
- TwinDie™ architecture: Identified as part of Micron's TwinDie™ series, enabling designers to reference series-level characteristics in system selection and BOM consolidation.
- Fast timing characteristics: 1.6 GHz clock frequency and 13.75 ns access time as specified, supporting applications that require rapid DRAM access cycles.
- Low-voltage operation: Specified supply range of 1.14 V–1.26 V reduces system power envelope within the provided voltage window.
- Compact package: 96-FBGA (10.5 × 13 mm) package reduces PCB area for high-density memory implementations.
- Extended temperature range: Operating range of 0 °C to 95 °C (TC) enables deployment in systems that operate across this thermal window.
Why Choose IC DRAM 32GBIT PARALLEL 96FBGA?
The MT40A2G16SKL-062E:B positions itself as a high-density DDR4 SDRAM component in a compact 96-FBGA package, combining a 2G × 16 organization and TwinDie™ series identification with the specified 1.6 GHz clock frequency and 13.75 ns access time. Its documented low-voltage supply range and 0 °C to 95 °C operating range provide clear, verifiable parameters for system design and power budgeting.
This device is suited to designs and customers who need a specified 32 Gbit DDR4 memory solution with a parallel interface and compact BGA footprint. The explicit specifications support straightforward integration, capacity planning, and thermal/power considerations over the product’s stated operating conditions.
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