MT29F64G08EBAAAWP-Z:A

The MT29F64G08EBAAAWP-Z:A is a 64 Gbit non-volatile FLASH device implementing NAND technology with an 8G × 8 memory organization. It provides parallel memory access in a 48-TSOP I package for systems that require high-density, board-mounted NAND storage.

Designed for use in applications that integrate parallel NAND FLASH, the device operates from a 2.7 V to 3.6 V supply and supports a commercial operating temperature range of 0°C to 70°C, enabling straightforward integration into a variety of embedded and legacy parallel-interface designs.

Key Features

• Memory Core  64 Gbit NAND FLASH memory organized as 8G × 8 for byte-wide parallel access and high-density storage.
• Interface  Parallel memory interface compatible with 8-bit parallel systems thanks to the 8G × 8 organization.
• Power  Operates from a 2.7 V to 3.6 V supply range to accommodate common 3.3 V system rails.
• Package  Delivered in a 48-TSOP I (48-TFSOP, 0.724", 18.40 mm width) surface-mount package for compact PCB mounting.
• Temperature Range  Commercial ambient operating range of 0°C to 70°C (TA).
• Non-Volatile Technology  NAND FLASH technology preserves stored data without power, suitable for persistent storage needs.

Typical Applications

• High-density non-volatile storage  Provides board-level NAND FLASH capacity for systems needing large on-board data storage.
• Embedded systems  Fits embedded designs requiring parallel FLASH memory in a compact 48-TSOP I package.
• Legacy parallel-interface designs  Suitable for designs that use an 8-bit parallel memory interface due to its 8G × 8 organization.

Unique Advantages

• High storage capacity: 64 Gbit density enables larger data or firmware images on a single device, reducing the need for multiple parts.
• Parallel interface compatibility: Byte-wide (×8) organization simplifies integration into existing parallel-memory controllers and boards.
• Flexible power range: 2.7 V to 3.6 V operation supports common 3.3 V system rails for straightforward power design.
• Compact surface-mount package: 48-TSOP I package (0.724", 18.40 mm width) allows space-efficient PCB layouts.
• Commercial temperature support: 0°C to 70°C operating range covers typical consumer and general-purpose electronics environments.
• Non-volatile data retention: NAND FLASH technology maintains stored data without power, suitable for persistent storage requirements.

Why Choose IC FLASH 64GBIT PAR 48TSOP I?

The MT29F64G08EBAAAWP-Z:A positions itself as a high-density, parallel NAND FLASH option that combines 64 Gbit capacity with an 8-bit parallel interface and a compact 48-TSOP I package. Its supply voltage range and commercial temperature rating make it appropriate for designs that need reliable on-board non-volatile storage within standard 3.3 V systems.

This device is well suited to engineers and procurement teams designing embedded and legacy parallel-interface systems that require scalable storage density, simplified board integration, and persistent memory without complex power requirements.

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