MT46V32M16CV-5B:J
| Part Description |
IC DRAM 512MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 1,591 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V32M16CV-5B:J – IC DRAM 512Mbit Parallel 60FBGA
The MT46V32M16CV-5B:J is a 512 Mbit volatile memory device implemented as DDR SDRAM with a parallel memory interface and a 32M × 16 organization. It provides 512 Mbit of DDR SDRAM in a compact 60-ball FBGA package for designs that require standard DDR memory building blocks.
Key technical characteristics include a 200 MHz clock frequency, 700 ps access time, a 15 ns write cycle time (word page), and a supply voltage range of 2.5 V to 2.7 V. The device is specified for commercial temperature operation from 0°C to 70°C (TA).
Key Features
- Memory Technology DDR SDRAM architecture providing volatile DRAM storage with a parallel memory interface.
- Capacity & Organization 512 Mbit total capacity organized as 32M × 16.
- Performance 200 MHz clock frequency with a 700 ps access time and a 15 ns write cycle time (word page) for predictable timing behavior.
- Power Operates from a 2.5 V to 2.7 V supply range.
- Package 60-ball TFBGA package; supplier device package listed as 60-FBGA (8×12.5).
- Operating Temperature Specified for commercial operation from 0°C to 70°C (TA).
Typical Applications
- Memory subsystems Use as on-board DDR memory where 512 Mbit capacity and a 32M × 16 organization are required.
- Embedded systems DDR SDRAM for embedded designs that require a parallel memory interface and a compact FBGA package footprint.
- Standard commercial electronics Suitable for commercial-temperature devices specified to operate between 0°C and 70°C (TA).
Unique Advantages
- DDR SDRAM Architecture: Provides standard DDR operation and a parallel interface for integration into existing DDR memory subsystems.
- Matched Timing Characteristics: 200 MHz clock, 700 ps access time and 15 ns write cycle time (word page) enable deterministic timing for system designers.
- Compact FBGA Package: 60-ball TFBGA (60-FBGA, 8×12.5) reduces board area while delivering 512 Mbit of memory.
- <strong-Wide Supply Range: 2.5 V to 2.7 V supply accommodates standard DDR voltage domains.
- Commercial Temperature Rating: Specified operation from 0°C to 70°C (TA) for commercial-grade deployments.
Why Choose MT46V32M16CV-5B:J?
The MT46V32M16CV-5B:J delivers a straightforward DDR SDRAM solution with clear performance and power specifications—200 MHz clocking, 700 ps access time, 15 ns write cycle time, and a 2.5 V–2.7 V supply—packaged in a 60-ball FBGA. It is positioned for applications that require a known DDR memory building block with a 32M × 16 organization and 512 Mbit capacity.
This device is suited to designers and procurement teams specifying commercial-temperature DDR memory for compact PCB layouts and standard DDR power domains, offering predictable timing and industry-standard packaging for integration into existing memory subsystems.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MT46V32M16CV-5B:J.