MT46V32M16CY-5B AIT:J
| Part Description |
IC DRAM 512MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 460 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT46V32M16CY-5B AIT:J – 512Mbit DDR SDRAM (32M × 16), 60-ball FBGA
The MT46V32M16CY-5B AIT:J is a 512 Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface. It implements an internal pipelined double-data-rate (DDR) architecture to deliver two data accesses per clock cycle and supports source-synchronous data capture with DQS.
Designed for applications requiring robust, high-speed parallel DRAM, this device targets automotive-grade and industrial embedded designs that need qualified DDR memory in a compact 60-ball FBGA package.
Key Features
- Core / Architecture Internal pipelined DDR architecture with two data accesses per clock cycle and differential clock inputs (CK / CK#).
- Memory Organization 512 Mbit total capacity organized as 32M × 16 with 4 internal banks for concurrent operation.
- Performance & Timing Rated clock frequency 200 MHz (DDR), access time 700 ps, and write cycle time (word page) of 15 ns. Speed grade -5B supports 5 ns cycle time (CL = 3).
- Data Capture & Masking Bidirectional data strobe (DQS) transmitted/received with data; data mask (DM) supported (x16 devices provide two DM signals, one per byte).
- Power & I/O VDD / VDDQ supply 2.5 V ±0.2 V (standard) and supported supply range 2.5 V to 2.7 V; 2.5 V I/O (SSTL_2 compatible).
- Refresh & Burst Auto refresh supported with 8K refresh cycles and programmable burst lengths of 2, 4, or 8.
- Package 60-ball FBGA package (10 mm × 12.5 mm footprint option) for compact board integration.
- Qualification & Temperature AEC‑Q100 qualification and operating ambient temperature range of -40 °C to +85 °C (TA), targeting automotive-grade applications.
Typical Applications
- Automotive electronic systems Automotive-grade DDR memory for embedded controllers and modules where AEC‑Q100 qualification and -40 °C to +85 °C operation are required.
- Industrial embedded systems Parallel DDR memory for industrial controllers and instrumentation that require rugged temperature ratings and compact packaging.
- High-speed parallel memory subsystems Use as board-level DDR SDRAM for systems that leverage source-synchronous DQS and programmable burst lengths for predictable data transfer patterns.
Unique Advantages
- DDR source-synchronous data capture: Bidirectional DQS with edge alignment for READs and center alignment for WRITEs improves reliable high-speed transfers in parallel DDR designs.
- Automotive-grade qualification: AEC‑Q100 qualification and specified -40 °C to +85 °C operating range provide component-level assurance for automotive and harsh-environment use.
- Compact FBGA footprint: 60-ball FBGA (10 mm × 12.5 mm option) enables tight board layouts while maintaining a parallel memory interface.
- High effective data rate: Double-data-rate operation at 200 MHz clock (DDR) yields two data transfers per clock cycle for higher throughput without higher clock frequencies.
- SSTL_2 compatible I/O: 2.5 V I/O and VDD/VDDQ supply options align with common DDR signaling standards for straightforward system integration.
Why Choose IC DRAM 512MBIT PARALLEL 60FBGA?
The MT46V32M16CY-5B AIT:J positions itself as a compact, automotive‑qualified DDR SDRAM option for designers needing a 512 Mbit, 32M × 16 parallel memory solution. Its DDR architecture, DQS support and programmable burst lengths make it suitable for systems requiring predictable, high-speed parallel data transfers within a small FBGA package.
This device is appropriate for engineers and procurement teams specifying automotive or industrial embedded memory where AEC‑Q100 qualification, wide ambient temperature range, and SSTL_2 2.5 V I/O compatibility are design drivers.
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