MT46V32M16CY-5B AIT:J

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 460 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeAutomotive
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.0036

Overview of MT46V32M16CY-5B AIT:J – 512Mbit DDR SDRAM (32M × 16), 60-ball FBGA

The MT46V32M16CY-5B AIT:J is a 512 Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface. It implements an internal pipelined double-data-rate (DDR) architecture to deliver two data accesses per clock cycle and supports source-synchronous data capture with DQS.

Designed for applications requiring robust, high-speed parallel DRAM, this device targets automotive-grade and industrial embedded designs that need qualified DDR memory in a compact 60-ball FBGA package.

Key Features

  • Core / Architecture  Internal pipelined DDR architecture with two data accesses per clock cycle and differential clock inputs (CK / CK#).
  • Memory Organization  512 Mbit total capacity organized as 32M × 16 with 4 internal banks for concurrent operation.
  • Performance & Timing  Rated clock frequency 200 MHz (DDR), access time 700 ps, and write cycle time (word page) of 15 ns. Speed grade -5B supports 5 ns cycle time (CL = 3).
  • Data Capture & Masking  Bidirectional data strobe (DQS) transmitted/received with data; data mask (DM) supported (x16 devices provide two DM signals, one per byte).
  • Power & I/O  VDD / VDDQ supply 2.5 V ±0.2 V (standard) and supported supply range 2.5 V to 2.7 V; 2.5 V I/O (SSTL_2 compatible).
  • Refresh & Burst  Auto refresh supported with 8K refresh cycles and programmable burst lengths of 2, 4, or 8.
  • Package  60-ball FBGA package (10 mm × 12.5 mm footprint option) for compact board integration.
  • Qualification & Temperature  AEC‑Q100 qualification and operating ambient temperature range of -40 °C to +85 °C (TA), targeting automotive-grade applications.

Typical Applications

  • Automotive electronic systems  Automotive-grade DDR memory for embedded controllers and modules where AEC‑Q100 qualification and -40 °C to +85 °C operation are required.
  • Industrial embedded systems  Parallel DDR memory for industrial controllers and instrumentation that require rugged temperature ratings and compact packaging.
  • High-speed parallel memory subsystems  Use as board-level DDR SDRAM for systems that leverage source-synchronous DQS and programmable burst lengths for predictable data transfer patterns.

Unique Advantages

  • DDR source-synchronous data capture: Bidirectional DQS with edge alignment for READs and center alignment for WRITEs improves reliable high-speed transfers in parallel DDR designs.
  • Automotive-grade qualification: AEC‑Q100 qualification and specified -40 °C to +85 °C operating range provide component-level assurance for automotive and harsh-environment use.
  • Compact FBGA footprint: 60-ball FBGA (10 mm × 12.5 mm option) enables tight board layouts while maintaining a parallel memory interface.
  • High effective data rate: Double-data-rate operation at 200 MHz clock (DDR) yields two data transfers per clock cycle for higher throughput without higher clock frequencies.
  • SSTL_2 compatible I/O: 2.5 V I/O and VDD/VDDQ supply options align with common DDR signaling standards for straightforward system integration.

Why Choose IC DRAM 512MBIT PARALLEL 60FBGA?

The MT46V32M16CY-5B AIT:J positions itself as a compact, automotive‑qualified DDR SDRAM option for designers needing a 512 Mbit, 32M × 16 parallel memory solution. Its DDR architecture, DQS support and programmable burst lengths make it suitable for systems requiring predictable, high-speed parallel data transfers within a small FBGA package.

This device is appropriate for engineers and procurement teams specifying automotive or industrial embedded memory where AEC‑Q100 qualification, wide ambient temperature range, and SSTL_2 2.5 V I/O compatibility are design drivers.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the MT46V32M16CY-5B AIT:J.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up