MT46V32M16CV-5B IT:J

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 543 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceN/A
QualificationN/AECCNN/AHTS CodeN/A

Overview of MT46V32M16CV-5B IT:J – IC DRAM 512MBIT PARALLEL 60FBGA

The MT46V32M16CV-5B IT:J is a 512 Mbit DDR SDRAM device in a parallel memory interface, organized as 32M × 16. It provides system memory in a compact 60-FBGA package suitable for designs that require DDR SDRAM operating at a 200 MHz clock rate.

Key Features

  • Memory Core 512 Mbit DRAM organized as 32M × 16, implemented using DDR SDRAM architecture.
  • Performance & Timing Supports a 200 MHz clock frequency with an access time of 700 ps and a write cycle time (word page) of 15 ns.
  • Power Operates from a 2.5 V to 2.7 V supply range.
  • Interface Parallel memory interface tailored for DDR SDRAM implementations.
  • Package & Mounting Supplied in a 60-TFBGA / 60-FBGA (8 × 12.5 mm) package for board-level mounting.
  • Operating Temperature Specified for operation from -40 °C to 85 °C (TA).

Unique Advantages

  • 512 Mbit Density: Provides a mid-range memory capacity in a single-device solution to simplify board-level memory design.
  • Parallel DDR Architecture: DDR SDRAM organization with a 32M × 16 arrangement supports parallel data paths for system memory implementations.
  • Deterministic Timing: 200 MHz clock and 700 ps access time with a 15 ns write cycle time (word page) provide clear timing parameters for system designers.
  • Compact FBGA Package: 60-FBGA (8 × 12.5 mm) packaging reduces board footprint while supporting surface-mount assembly.
  • Wide Temperature Range: Rated from -40 °C to 85 °C (TA) for designs requiring extended ambient operation.
  • Standard Supply Voltage: 2.5 V–2.7 V supply compatibility with DDR memory system power rails.

Why Choose IC DRAM 512MBIT PARALLEL 60FBGA?

The MT46V32M16CV-5B IT:J positions itself as a straightforward DDR SDRAM option for designs that need 512 Mbit of parallel memory with defined timing and electrical characteristics. Its 200 MHz clock rating, 700 ps access time, and 32M × 16 organization make it suitable for systems specifying DDR SDRAM devices in a compact FBGA package.

Engineers integrating this device benefit from clear electrical and thermal parameters—2.5 V–2.7 V supply range and -40 °C to 85 °C operating temperature—enabling predictable behavior across a variety of board-level designs.

Please request a quote or submit a pricing and availability inquiry for the MT46V32M16CV-5B IT:J to obtain lead times and volume pricing information.

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