MT48LC16M16A2BG-75 IT:D TR
| Part Description |
IC DRAM 256MBIT PAR 54VFBGA |
|---|---|
| Quantity | 1,154 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-VFBGA (8x14) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 54-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT48LC16M16A2BG-75 IT:D TR – IC DRAM 256MBIT PAR 54VFBGA
The MT48LC16M16A2BG-75 IT:D TR is a 256 Mbit volatile SDRAM organized as 16M × 16 with a parallel memory interface. It implements a fully synchronous, pipelined SDRAM architecture targeting PC100/PC133-compliant systems and board-level designs that require a 3.3 V single-supply, high-speed parallel memory solution.
Key attributes include a 133 MHz clock frequency, a compact 54-ball VFBGA package (8 × 14 mm), industrial operating temperature range (−40°C to +85°C), and timing suited for burst and pipelined memory transactions.
Key Features
- Core / Memory Organization — 256 Mbit SDRAM organized as 16M × 16 with four internal banks for row access and precharge management.
- Performance — PC100- and PC133-compliant operation with a 133 MHz clock frequency and an access time listed as 5.4 ns; supports pipelined operation and column address changes every clock cycle.
- Timing & Burst — Programmable burst lengths (1, 2, 4, 8, or full page) and support for auto precharge and auto refresh modes to simplify burst read/write sequencing.
- Refresh & Low-Power Modes — Auto refresh and self refresh capability (not available on AT devices per datasheet options); 8192-cycle refresh supported.
- Interface & I/O — Parallel SDRAM interface with LVTTL-compatible inputs and outputs and a write cycle time (word/page) of 15 ns.
- Power — Single supply voltage range of 3.0 V to 3.6 V (3.3 V nominal).
- Package — 54-ball VFBGA (54-VFBGA, 8 × 14 mm) in a compact BGA footprint for board-level integration.
- Operating Range — Industrial temperature specification from −40°C to +85°C (TA).
Typical Applications
- PC100/PC133-compatible memory subsystems — Use as synchronous DRAM in systems designed around PC100/PC133 timing.
- Board-level parallel memory — Dense 54-ball VFBGA package suited for compact PCBs requiring parallel SDRAM with 16M × 16 organization.
- Industrial embedded systems — Suitable for designs operating across an industrial temperature range (−40°C to +85°C) where a 3.3 V SDRAM is required.
Unique Advantages
- Industry-standard timing compliance: PC100/PC133 compliance simplifies integration into existing PC100/PC133 system architectures.
- Pipelined, synchronous operation: Fully synchronous design with pipelined internal operation allows column addresses to change every clock cycle for predictable throughput.
- Flexible burst and refresh modes: Programmable burst lengths plus auto refresh and self refresh options enable efficient sequential transfers and low-power retention modes.
- Compact BGA footprint: The 54-ball VFBGA (8 × 14 mm) package reduces board area compared with larger packages while delivering a parallel SDRAM interface.
- Industrial temperature rating: −40°C to +85°C operating range supports deployment in temperature-demanding environments.
- Standard 3.3 V supply: Single-supply operation (3.0 V to 3.6 V) aligns with common system power rails for straightforward power design.
Why Choose IC DRAM 256MBIT PAR 54VFBGA?
The MT48LC16M16A2BG-75 IT:D TR provides a straightforward 256 Mbit SDRAM solution for designs requiring a parallel, fully synchronous memory with PC100/PC133 timing, pipelined operation, and flexible burst capabilities. Its 16M × 16 organization, 133 MHz clock grade, and compact 54-ball VFBGA package make it suitable for board-level integration where space and predictable SDRAM timing are important.
Manufactured by Micron Technology Inc., this device combines industrial-temperature operation and standard 3.3 V supply compatibility, offering a clear specification set for engineering and procurement teams focused on system-level memory performance and integration.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MT48LC16M16A2BG-75 IT:D TR.